SiTime SIT1552AI-JE-DCC-32.768E
| Manufacturer | |
| MPN | SIT1552AI-JE-DCC-32.768E |
| LCSC Part # | C7464055 |
| Packaging | CSP-4(0.8x1.5) |
| Customer # | |
| Key Attributes | Smallest, Ultra-Low Power, 32.768 kHz MEMS TCXO |
| Datasheet |
Products Specifications
Show similar products (0) >| Type | Description | |
|---|---|---|
| Category | Passives/Crystals, Oscillators, Resonators/Oscillators | |
| Manufacturer | SiTime | |
| Packaging | CSP-4(0.8x1.5) |
Additional Information
| Type | Details |
|---|---|
| Minimum | 1 |
| Multiple | 1 |
| Standard Packaging | 2500 |
| Sales Unit | Piece |
| EDA Models | EasyEDA Model |
Introduction
The SiT1552 is an ultra-small and ultra-low power 32.768 kHz TCXO optimized for battery-powered applications. Silicon MEMS technology enables the first 32 kHz TCXO in the world’s smallest footprint and chip-scale packaging (CSP). Typical core supply current is only 1 μA.
SiTime’s MEMS oscillators consist of MEMS resonators and a programmable analog circuit. MEMS resonators are built with SiTime’s unique MEMS First process. A key manufacturing step is EpiSeal during which the MEMS resonator is annealed with temperatures over 1000℃. EpiSeal creates an extremely strong, clean, vacuum chamber that encapsulates the MEMS resonator and ensures the best performance and reliability. During EpiSeal, a poly silicon cap is grown on top of the resonator cavity, which eliminates the need for additional cap wafers or other exotic packaging. As a result, SiTime’s MEMS resonator die can be used like any other semiconductor die. One unique result of SiTime’s MEMS First and EpiSeal manufacturing processes is the capability to integrate SiTime’s MEMS die with a SOC, ASIC, microprocessor or analog die within a package to eliminate external timing components and provide a highly integrated, smaller, cheaper solution to the customer.
Features
- 32.768 kHz ±5, ±10, ±20 ppm frequency stability options over temp
- World’s smallest TCXO in a 1.5×0.8 mm CSP
- Operating temperature ranges: 0°C to +70°C, -40°C to +85°C
- Ultra-low power: < 1 μA
- Vdd supply range: 1.5 V to 3.63 V
- Improved stability reduces system power with fewer network timekeeping updates
- Internal filtering eliminates external Vdd bypass cap and saves space
- Pb-free, RoHS and REACH compliant
Applications
- Smart Meters (AMR)
- Health and Wellness Monitors
- Pulse-per-Second (pps) Timekeeping
- RTC Reference Clock
| Qty | Unit Price(Reference Only) | Total Amount |
|---|---|---|
| 1+ | $ 1.5269 | $ 1.53 |
| 10+ | $ 1.2684 | $ 12.68 |
| 30+ | $ 1.1264 | $ 33.79 |
| 100+ | $ 0.9669 | $ 96.69 |
| 500+ | $ 0.8951 | $ 447.55 |
| 1,000+ | $ 0.8632 | $ 863.20 |
Standard Packaging2500/Full Reel | ||
Products Specifications
Show similar products (0) >| Type | Description | |
|---|---|---|
| Category | Passives/Crystals, Oscillators, Resonators/Oscillators | |
| Manufacturer | SiTime | |
| Packaging | CSP-4(0.8x1.5) |
Additional Information
| Type | Details |
|---|---|
| Minimum | 1 |
| Multiple | 1 |
| Standard Packaging | 2500 |
| Sales Unit | Piece |
| EDA Models | EasyEDA Model |
Introduction
The SiT1552 is an ultra-small and ultra-low power 32.768 kHz TCXO optimized for battery-powered applications. Silicon MEMS technology enables the first 32 kHz TCXO in the world’s smallest footprint and chip-scale packaging (CSP). Typical core supply current is only 1 μA.
SiTime’s MEMS oscillators consist of MEMS resonators and a programmable analog circuit. MEMS resonators are built with SiTime’s unique MEMS First process. A key manufacturing step is EpiSeal during which the MEMS resonator is annealed with temperatures over 1000℃. EpiSeal creates an extremely strong, clean, vacuum chamber that encapsulates the MEMS resonator and ensures the best performance and reliability. During EpiSeal, a poly silicon cap is grown on top of the resonator cavity, which eliminates the need for additional cap wafers or other exotic packaging. As a result, SiTime’s MEMS resonator die can be used like any other semiconductor die. One unique result of SiTime’s MEMS First and EpiSeal manufacturing processes is the capability to integrate SiTime’s MEMS die with a SOC, ASIC, microprocessor or analog die within a package to eliminate external timing components and provide a highly integrated, smaller, cheaper solution to the customer.
Features
- 32.768 kHz ±5, ±10, ±20 ppm frequency stability options over temp
- World’s smallest TCXO in a 1.5×0.8 mm CSP
- Operating temperature ranges: 0°C to +70°C, -40°C to +85°C
- Ultra-low power: < 1 μA
- Vdd supply range: 1.5 V to 3.63 V
- Improved stability reduces system power with fewer network timekeeping updates
- Internal filtering eliminates external Vdd bypass cap and saves space
- Pb-free, RoHS and REACH compliant
Applications
- Smart Meters (AMR)
- Health and Wellness Monitors
- Pulse-per-Second (pps) Timekeeping
- RTC Reference Clock
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | |
| ECCN | EAR99 |
| CNHTS | 8541600000 |
| USHTS | 8541600080 |
| TARIC | 8541600000 |
| CAHTS | 8541600010 |
| BRHTS | 85416010 |
| INHTS | 85416000 |
| MXHTS | 8541.60.01 |
| Type | Details |
|---|---|
| RoHS | |
| ECCN | EAR99 |
| CNHTS | 8541600000 |
| USHTS | 8541600080 |
| TARIC | 8541600000 |
| Type | Details |
|---|---|
| CAHTS | 8541600010 |
| BRHTS | 85416010 |
| INHTS | 85416000 |
| MXHTS | 8541.60.01 |



