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HGSEMI HG25Q64MW/TR product image
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HGSEMI HG25Q64MW/TRRoHS

Manufacturer
HGSEMIAsian Brands
MPN
HG25Q64MW/TR
LCSC Part #
C19193461
Packaging
SOP-8-208mil
Customer #
Key Attributes
Serial Flash Memory with Dual, Quad SPI
Datasheetpdf iconHGSEMI HG25Q64MW/TR
Not available now

Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory (ICs)
ManufacturerHGSEMI
PackagingSOP-8-208mil
Voltage - Supply2.7V~3.6V
Memory Size64Mbit
Operating temperature-40℃~+85℃
Program / Erase Cycles10000 times
Clock Frequency104MHz
FeaturesWrite enable latch;Power-on reset;Hardware write protection;Software write protection;Absolute write protection
Data Retention - TDR (Year)20 Years
Block Erase Time(tBE)120ms@(32KB)
Page Programming Time (Tpp)3ms
Standby Supply Current3uA
InterfaceSPI

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging2500
Sales UnitPiece

Introduction

AI Translation

The HG25Q64 (64M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25S series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on 3.0V to 3.6V power supply with current consumption as low as 3μA for power-down. All devices are offered in space-saving packages. The HG25Q64 array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The HG25Q64 has 2,048 erasable sectors and 128 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. The HG25Q64 supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 and I/O3. SPI clock frequencies of HG25Q64 of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual and 532MHz (80MHz x 4) for Quad when using the Fast Read Dual/Quad I/O. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. Additionally, the device supports JEDEC standard manufacturer and device ID, and a 64-bit Unique Serial Number and three 256-bytes Security Registers.

Features

AI Translation
  • HG25Q64 : 64M-bit / 8M-byte
  • Standard SPI: CLK, /CS, DI, DO,/WP,/Hold
  • Dual SPI: CLK, /CS, IO0, IO1 ,/WP,/Hold
  • Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
  • Software & Hardware Reset
  • 104MHz Single, Dual/Quad SPI clocks
  • 260/320MHz equivalent Dual/Quad SPI
  • More than 10,000 erase/progran cycles
  • More than 20-year data retention
  • Continuous Read with 8/16/32/64-Byte Wrap
  • As few as 8 clocks to address memory
  • Single 2.7 to 3.6V supply
  • -4mA active current, <3μA Power-down (typ.)
  • -40℃ to +85℃ operating range
  • Software and Hardware Write-Protect
  • Power Supply Lock-Down and OTP protection
  • Top/Bottom, Complement array protection
  • 64-Bit Unique ID for each device
  • Discoverable Parameters (SFDP) Register
  • 3X256-Bytes Security Registers
  • Volatile & Non-volatile Status Register Bits