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Alliance Memory ASFC4G31M-51BIN product image
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Alliance Memory ASFC4G31M-51BINRoHS

Manufacturer
Alliance Memory
MPN
ASFC4G31M-51BIN
LCSC Part #
C5570292
Packaging
FBGA-153(11.5x13)
Customer #
Key Attributes
4GB eMMC 153 ball FBGAPACKAGE
Datasheetpdf iconAlliance Memory ASFC4G31M-51BIN

Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory (ICs)
ManufacturerAlliance Memory
PackagingFBGA-153(11.5x13)
Memory Size4GB
Operating temperature-40℃~+85℃
Reading Speed in Sequence120MB/S
Writing Speed in Sequence50MB/S
FeaturesBuilt-in wear leveling function;Bad block management function;ECC error correction function;Secure erase function;Hardware reset function;Secure write protection function
configurationMLC
NAND Stand-By Current-
Controller Stand-By Current-
NAND Operating Voltage (VCCF)2.7V~3.6V
InterfaceeMMC 5.1
Controller Operating Voltage (VCCQ)1.7V~1.95V;2.7V~3.6V
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Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging160
Sales UnitPiece

Introduction

AI Translation

4GB eMMC device (AS04FC) is a high performance embedded MMC solution designed for embedded NAND flash applications. It supports eMMC/JEDEC 5.1 industry standard and is backward compatible with eMMC 4.5 & 5.0 version.

AS04FC device contains both MLC NAND flash and eMMC controller. A single 3V supply voltage is for the NAND area (VCC) with internal regulator and Dual supply voltages 1.8V or 3V (VCCQ) for eMMC controller. Customers find it easy to use AS04FC without having to consider any changes inside device such as Flash, leading to easier & faster development of applications (fast time to market).

featured embedded flash management software or FTL(Flash Transition Layer) of eMMC manages high reliability with noticeable Wear Leveling, Bad Block Management and strong ECC and achieves high performance.

Features

AI Translation
  • Supports features of eMMC5.1 which are defined in JEDEC Standard - Supported Features: Boot, RPMB, Write Protection, DDR, HS200, Multi-partitioning, Secure Erase/Trim, Trim, HPI, Background operation, Enhance Reliable Write, Discard, Sanitize, Security features, Partition types, Packed commands, Real time clock, Dynamic device capacity, Power off notification, Thermal spec, Cache, HS400, Field Firmware Update, Security Removal type, Device Health Report, Enhanced Strobe, Command Queuing, Secure Write protection
  • Non-supported Features: Large Sector Size (4KB)
  • Supports Enhanced Strobe feature of new eMMC standard of version 5.1.
  • Full backward compatibility with previous eMMC 4.41/4.5/5.0 specification and MultiMediaCard system specification (1bit data bus, multi-eMMC systems)
  • Programmable bus width: 1bit (Default), 4bit and 8bit Data bus.
  • MMC I/F Clock Frequency: 0 ~ 200MHz
  • MMC I/F Boot Frequency: 0 ~ 52MHz
  • Operating Temperature: -40℃ ~ 85℃
  • Storage Temperature: -40℃ ~ 85℃
  • Operating Power Supply: VCC: 2.7V ~ 3.6V (for NAND Flash Memory), VCCQ: 1.7V ~ 1.95V or 2.7V ~ 3.6V (for Interface)
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QtyUnit Price(Reference Only)Total Amount
1+$ 7.3172$ 7.32
10+$ 7.1467$ 71.47
30+$ 7.0336$ 211.01
100+$ 6.9204$ 692.04
Standard Packaging160/Full Tray
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