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KIOXIA THGBMJG6C1LBAIL product image
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KIOXIA THGBMJG6C1LBAILRoHS

Manufacturer
KIOXIA
MPN
THGBMJG6C1LBAIL
LCSC Part #
C524518
Packaging
BGA-153
Customer #
Key Attributes
e-MMC Module
Datasheetpdf iconKIOXIA THGBMJG6C1LBAIL

Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory (ICs)
ManufacturerKIOXIA
PackagingBGA-153
Memory Size8GB
Operating temperature-25℃~+85℃
Reading Speed in Sequence215MB/S
Writing Speed in Sequence35MB/S
FeaturesBad block management function;Hardware reset function
configuration-
NAND Stand-By Current-
Controller Stand-By Current-
NAND Operating Voltage (VCCF)2.7V~3.6V
InterfaceeMMC 5.1
Controller Operating Voltage (VCCQ)1.7V~1.95V;2.7V~3.6V
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Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging152
Sales UnitPiece

Introduction

AI Translation

THGBMJG6C1LBAIL is 8GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMJG6C1LBAIL has an industry standard MMC protocol for easy use.

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