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GigaDevice Semicon Beijing GD32F130C8T6 product image
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GigaDevice Semicon Beijing GD32F130C8T6RoHS

Manufacturer
MPN
GD32F130C8T6
LCSC Part #
C80735
Packaging
LQFP-48(7x7)
Customer #
Key Attributes
ARM Cortex-M3 32-bit MCU
Datasheetpdf iconGigaDevice Semicon Beijing GD32F130C8T6
In-Stock: 11,676
11,676 In stock, ships now
Add to BOM List
QtyUnit PriceTotal Amount
1+$ 1.259$ 1.26
10+$ 1.0378$ 10.38
30+$ 0.9174$ 27.52
250+$ 0.7792$ 194.80
500+$ 0.719$ 359.50
1,000+$ 0.6913$ 691.30
Standard Packaging250/Full Tray
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/Microcontrollers
ManufacturerGigaDevice Semicon Beijing
PackagingLQFP-48(7x7)
ADC (Bit)12bit
Operating Temperature-40℃~+85℃
Voltage - Supply2.6V~3.6V
Program Memory TypeFLASH
Program Storage Size64KB
CPU CoreARM Cortex-M3
CPU Maximum Speed72MHz
Oscillator TypeBuilt-in+External
Number of I/O39

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging250
Sales UnitPiece

Introduction

AI Translation

The GD32F130xx device belongs to the value line of GD32 MCU family. It is a 32-bit general-purpose microcontroller based on the high performance ARM Cortex-M3 RISC core with best ratio in terms of processing power, reduced power consumption and peripheral set. The Cortex-M3 is a next generation processor core which is tightly coupled with a Nested Vectored Interrupt Controller (NVIC), SysTick timer and advanced debug support. The GD32F130xx device incorporates the ARM Cortex-M3 32-bit processor core operating at 72 MHz frequency with Flash accesses zero wait states to obtain maximum efficiency. It provides up to 64 KB on-chip Flash memory and up to 8 KB SRAM memory. An extensive range of enhanced I/Os and peripherals connected to two APB buses. The devices offer one 12-bit ADC, up to five general 16-bit timers, a general 32-bit timer, a PWM advanced timer, as well as standard and advanced communication interfaces: up to two SPIs, two I2Cs and two USARTs. The device operates from a 2.6 to 3.6 V power supply and available in -40 to +85 ℃ temperature range. Several power saving modes provide the flexibility for maximum optimization between wakeup latency and power consumption, an especially important consideration in low power applications.