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TI TMS320F28335PTPQRoHS

Manufacturer
MPN
TMS320F28335PTPQ
LCSC Part #
C83635
Packaging
LQFP-176(24x24)
Customer #
Key Attributes
Digital Signal Controllers (DSCs)
Datasheetpdf iconTI TMS320F28335PTPQ
In-Stock: 123
123 In stock, ships now
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QtyUnit PriceTotal Amount
1+$ 24.4865$ 24.49
10+$ 23.5265$ 235.27
40+$ 21.8629$ 874.52
80+$ 20.4132$ 1633.06
Standard Packaging40/Full Tray
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/Microcontrollers
ManufacturerTI
PackagingLQFP-176(24x24)
ADC (Bit)12bit
Operating Temperature-40℃~+125℃
Program Memory TypeFLASH
Voltage - Supply1.805V~1.995V
EEPROM-
Program Storage Size512KB
CPU CoreOthers
Core Size32 Bit
CPU Maximum Speed150MHz
Oscillator TypeBuilt-in
Number of I/O88

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging40
Sales UnitPiece

Introduction

AI Translation

C2000™32-bit microcontrollers are optimized for processing, sensing, and actuation to improve closedloop performance in real-time control applications such as industrial motor drives; solar inverters and digital power; electrical vehicles and transportation; motor control; and sensing and signal processing. The C2000 line includes the Delfino™Premium Performance family and the Piccolo™ Entry Performance family.

TMS320C2000™32-bit microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop performance in real-time control applications. The C2000™microcontrollers line includes the Delfino™ Premium Performance microcontroller family and the Piccolo™ Entry Performance microcontroller family.

The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices, members of the TMS320C28x/ Delfino™ DSC/MCU generation, are highly integrated, high-performance solutions for demanding control applications.

Features

AI Translation
  • High-performance static CMOS technology – Up to 150 MHz (6.67-ns cycle time) – 1.9-V/1.8-V core, 3.3-V I/O design
  • High-performance 32-bit CPU (TMS320C28x) – IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only) – 16x16 and 32x32 MAC operations – 16x16 dual MAC – Harvard bus architecture – Fast interrupt response and processing – Unified memory programming model – Code-efficient (in C/C++ and Assembly)
  • Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
  • 16-bit or 32-bit External Interface (XINTF) – More than 2Mx16 address reach
  • On-chip memory – F28335, F28333, F28235: 256Kx16 flash, 34Kx16 SARAM – F28334, F28234: 128Kx16 flash, 34Kx16 SARAM – F28332, F28232: 64Kx16 flash, 26Kx16 SARAM – 1κx16 OTP ROM
  • Boot ROM (8Kx16) – With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O) – Standard math tables
  • Clock and system control – On-chip oscillator – Watchdog timer module
  • GPIO0 to GPIO63 pins can be connected to one of the eight external core interrupts
  • Peripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts
  • 128-bit security key/lock – Protects flash/OTP/RAM blocks – Prevents firmware reverse-engineering
  • Enhanced control peripherals – Up to 18 PWM outputs – Up to 6 HRPWM outputs with 150-ps MEP resolution – Up to 6 event capture inputs – Up to 2 Quadrature Encoder interfaces – Up to 8 32-bit timers (6 for eCAPs and 2 for eQEPs) – Up to 9 16-bit timers (6 for ePWMs and 3 XINTCTRs)
  • Three 32-bit CPU timers
  • Serial port peripherals – Up to 2 CAN modules – Up to 3 SCI (UART) modules – Up to 2 McBSP modules (configurable as SPI) – One SPI module – One Inter-Integrated Circuit (I2C) bus
  • 12-bit ADC, 16 channels – 80-ns conversion rate – 2x8 channel input multiplexer – Two sample-and-hold – Single/simultaneous conversions – Internal or external reference
  • Up to 88 individually programmable, multiplexed GPIO pins with input filtering
  • JTAG boundary scan support – IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
  • Advanced emulation features – Analysis and breakpoint functions – Real-time debug using hardware
  • Development support includes – ANSI C/C++ compiler/assembler/linker – Code Composer Studio™IDE – DSP/BIOS™and SYS/BIOS – Digital motor control and digital power software libraries
  • Low-power modes and power savings – IDLE, STANDBY, HALT modes supported – Disable individual peripheral clocks
  • Endianness: Little endian
  • Package options: Lead-free, green packaging 176-ball plastic Ball Grid Array (BGA) (ZJZ) 179-ball MicroStar BGA™(ZHH) 176-pin Low-Profile Quad Flatpack (LQFP) (PGF) 176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) (PTP)
  • Temperature options: A: -40°C to 85°C (PGF, ZHH, ZJZ) – S: -40°C to 125°C (PTP, ZJZ) Q: -40°C to 125°C (PTP, ZJZ) (AEC Q100 qualification for automotive applications)

Applications

AI Translation
  • Advanced Driver Assistance Systems (ADAS)
  • Building automation
  • Electronic point of sale
  • Electric Vehicle/Hybrid Electric Vehicle (EV/HEV)
  • powertrain
  • Factory automation
  • Grid infrastructure
  • Industrial transport
  • Medical, healthcare and fitness
  • Motor drives
  • Power delivery
  • Telecom infrastructure
  • Test and measurement