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TI TMS320F28377DPTPTRoHS

Manufacturer
MPN
TMS320F28377DPTPT
LCSC Part #
C83048
Packaging
LQFP-176(24x24)
Customer #
Key Attributes
Dual-core Delfino microcontroller
Datasheetpdf iconTI TMS320F28377DPTPT
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QtyUnit PriceTotal Amount
1+$ 15.2557$ 15.26
10+$ 14.0492$ 140.49
40+$ 12.9662$ 518.65
80+$ 12.0211$ 961.69
Standard Packaging40/Full Tray
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/Microcontrollers
ManufacturerTI
PackagingLQFP-176(24x24)
DAC (Bit)12bit
ADC (Bit)12bit;16bit
Operating Temperature-40℃~+105℃@(TJ)
Program Memory TypeFLASH
Voltage - Supply1.14V~3.47V
EEPROM-
Program Storage Size1MB
CPU CoreOthers
Core Size32 Bit
CPU Maximum Speed200MHz
Oscillator TypeBuilt-in
Number of I/O97

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging40
Sales UnitPiece

Introduction

AI Translation

Delfino TMS320F2837xD is a powerful 32-bit floating-point microcontroller unit (MCU) designed for advanced closed-loop control applications, such as industrial drives and servo motor control, solar inverters and converters, digital power supplies, power delivery, and power line communication. The F2837xD supports a new dual-core C28x architecture, significantly improving system performance; it also integrates analog and control peripherals, allowing designers to integrate control architectures and eliminating the need for multiple processors in high-end systems.

The dual real-time control subsystems are based on TI's 32-bit C28x floating-point CPU, providing 200MHz signal processing performance in each core. The performance of the C28x CPU is further enhanced by the new TMU accelerator and VCU accelerator. The TMU accelerator can quickly execute algorithms containing trigonometric operations common in transformation and torque loop calculations; the VCU accelerator can shorten the time of complex mathematical operations common in coding applications.

The F2837xD microcontroller series uses two CLA real-time control coprocessors. The CLA is an independent 32-bit floating-point processor that runs at the same speed as the main CPU. The CLA responds to peripheral triggers and executes code simultaneously with the main C28x CPU. This parallel processing function can effectively double the computing performance of the real-time control system. By using the CLA to perform time-critical functions, the main C28x CPU can be freed up for other tasks such as communication and diagnosis. The dual C28x+CLA architecture enables intelligent partitioning between various system tasks. For example, one C28x+CLA core can be used to track speed and position, while the other C28x+CLA core can be used to control torque and current loops.

The TMS320F2837xD supports up to 1MB (512KW) of on-board flash memory (with error correction code (ECC)) and up to 204KB (102KW) of SRAM. Two 128-bit security zones are also provided on each CPU for code protection.

The F2837xD MCU also integrates performance analog and control peripherals to further achieve system integration. Four independent 16-bit ADCs can accurately and efficiently manage multiple analog signals, ultimately improving system throughput. The new Σ-Δ filter module (SDFM) works with the Σ-Δ modulator to achieve isolated shunt measurement. The comparator subsystem (CMPSS) containing window comparators can protect the power stage when current limit conditions are exceeded or not met. Other analog and control peripherals include DAC, PWM, eCAPs, eQEP, and other peripherals.

With the configurable logic module (CLB), Texas Instruments (TI) can provide additional interface and control functions for selected C2000 devices.

Peripherals such as EMIF, CAN modules (compliant with ISO11898-1/CAN 2.0B), and the new uPP interface extend the connectivity of the F2837xD. The uPP interface is a new feature of the C2000 MCU, supporting high-speed parallel connection with FPGA or other processors using a similar uPP interface. Finally, the USB 2.0 port with MAC and PHY allows users to easily add universal serial bus (USB) connectivity to their applications.

Features

AI Translation
  • Dual-core architecture
  • Two TMS320C28x 32-bit CPUs
  • 200MHz IEEE-754 single-precision FPU, Trigonometric Math Unit (TMU), Viterbi/Complex Math Unit (VCU-II)
  • Two programmable Control Law Accelerators (CLA)
  • 200MHz
  • IEEE 754 single-precision floating-point instructions
  • Code execution independent of main CPU
  • On-chip memory
  • 512KB (256KW) or 1MB (512KW) flash (ECC-protected)
  • 172KB (86KW) or 204KB (102KW) RAM (ECC-protected or parity-protected)
  • Dual-zone security supporting third-party development
  • Clock and system control
  • Two internal zero-pin 10MHz oscillators
  • On-chip crystal oscillator
  • Windowed watchdog timer module
  • Missing clock detection circuit
  • Two Multi-channel Buffered Serial Ports (McBSP)
  • Four Serial Communication Interfaces (SCI/UART) (pin-bootable)
  • Two I2C interfaces (pin-bootable)
  • Analog subsystem
  • Up to four ADCs
  • 12-bit mode throughput of 3.5MSPS per converter (system throughput up to 14MSPS)
  • Up to 24 external single-ended input channels
  • 1.2V core, 3.3V I/O design
  • System peripherals
  • Two External Memory Interfaces (EMIF) supporting ASRAM and SDRAM
  • Dual 6-channel DMA controller
  • Up to 169 individually programmable, multiplexed GPIO pins with input filtering
  • Enhanced Peripheral Interrupt Expansion controller (ePIE)
  • Multiple Low-Power Modes (LPM) with external wake-up support
  • USB 2.0 (MAC + PHY)
  • 12-pin 3.3V-compatible Universal Parallel Port (uPP) interface support
  • Two CAN modules (pin-bootable)
  • Three high-speed (up to 50MHz) SPI ports (pin-bootable)
  • Eight windowed comparators with 12-bit DAC reference
  • Three 12-bit buffered DAC outputs
  • Enhanced control peripherals
  • Six enhanced capture (eCAP) modules
  • Three enhanced quadrature encoder pulse (eQEP) modules
  • Package options:
  • Lead-free, green packaging
  • 337-ball new Fine-pitch BGA (nFBGA) [suffix ZWT]
  • 176-pin PowerPAD thermally enhanced Half-size Low-profile QFP (HLQFP) [suffix PTP]
  • 100-pin PowerPAD thermally enhanced Thin QFP (HTQFP) [suffix PZP]
  • Temperature options:
  • T: -40°C to 105°C (junction temperature)
  • S: -40°C to 125°C (junction temperature)
  • Q: -40°C to 125°C (still air) (Q100 qualified for automotive applications)

Applications

AI Translation
  • Industrial drive products
  • Solar micro-inverters and converters
  • Radar
  • Digital power
  • Smart metering
  • Automotive transportation
  • Power line communication