TECHFUSE mSMD260-16V
| Manufacturer | TECHFUSEAsian Brands |
| MPN | mSMD260-16V |
| LCSC Part # | C70129 |
| Packaging | 1812 |
| Customer # | |
| Key Attributes | PTC RESET FUSE 16V 2.6A 1812 |
| Datasheet |
Products Specifications
Show similar products (0) >| Type | Description | |
|---|---|---|
| Category | Circuit Protection/PTC Resettable Fuses | |
| Manufacturer | TECHFUSE | |
| Packaging | 1812 | |
| Operating Temperature | -40℃~+85℃ | |
| Voltage - Max | 16V | |
| Hold Current | 2.6A | |
| Current - Max | 100A | |
| Power Dissipation | 800mW | |
| Trip Current | 5A | |
| Time to Trip(Max) | 2.5s | |
| Resistance @ 25℃ | 15mΩ | |
| Resistance - Post Trip (R1) (Max) | 80mΩ |
Report an ErrorShow similar products (0) >
Additional Information
| Type | Details |
|---|---|
| Minimum | 10 |
| Multiple | 10 |
| Standard Packaging | 1500 |
| Sales Unit | Piece |
| EDA Models | EasyEDA Model |
Features
AI Translation
- Terminal pad material: tin-plated nickel copper
- Terminal pad solderability: compliant with EIA specification RS186-9E and ANSI/J-STD-002 Class 3 standards
- Recommended reflow methods: infrared, vapor phase, convection oven
- Recommended maximum stencil thickness: 0.25mm (0.010 in)
- Storage conditions: max 40℃, relative humidity 70%
In-Stock: 80
80 In stock, ships now
Add to BOM List
| Qty | Unit Price | Total Amount |
|---|---|---|
| 10+ | $ 0.0706$ 0.0671 | $ 0.67 |
| 100+ | $ 0.0566$ 0.0538 | $ 5.38 |
| 300+ | $ 0.0496$ 0.0472 | $ 14.16 |
| 1,500+ | $ 0.0443$ 0.0421 | $ 63.15 |
| 4,500+ | $ 0.0401$ 0.0381 | $ 171.45 |
| 10,500+ | $ 0.038$ 0.0361 | $ 379.05 |
Standard Packaging1500/Full Reel | ||
Better price for more quantity?
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Products Specifications
Show similar products (0) >| Type | Description | |
|---|---|---|
| Category | Circuit Protection/PTC Resettable Fuses | |
| Manufacturer | TECHFUSE | |
| Packaging | 1812 | |
| Operating Temperature | -40℃~+85℃ | |
| Voltage - Max | 16V | |
| Hold Current | 2.6A | |
| Current - Max | 100A | |
| Power Dissipation | 800mW | |
| Trip Current | 5A | |
| Time to Trip(Max) | 2.5s | |
| Resistance @ 25℃ | 15mΩ | |
| Resistance - Post Trip (R1) (Max) | 80mΩ |
Report an ErrorShow similar products (0) >
Additional Information
| Type | Details |
|---|---|
| Minimum | 10 |
| Multiple | 10 |
| Standard Packaging | 1500 |
| Sales Unit | Piece |
| EDA Models | EasyEDA Model |
Features
AI Translation
- Terminal pad material: tin-plated nickel copper
- Terminal pad solderability: compliant with EIA specification RS186-9E and ANSI/J-STD-002 Class 3 standards
- Recommended reflow methods: infrared, vapor phase, convection oven
- Recommended maximum stencil thickness: 0.25mm (0.010 in)
- Storage conditions: max 40℃, relative humidity 70%
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | |
| ECCN | EAR99 |
| CNHTS | 8536100000 |
| USHTS | 8536100040 |
| TARIC | 8536109010 |
| CAHTS | 8536100000 |
| BRHTS | 85361000 |
| INHTS | 85361010 |
| MXHTS | 8536.10.01 |
| Type | Details |
|---|---|
| RoHS | |
| ECCN | EAR99 |
| CNHTS | 8536100000 |
| USHTS | 8536100040 |
| TARIC | 8536109010 |
| Type | Details |
|---|---|
| CAHTS | 8536100000 |
| BRHTS | 85361000 |
| INHTS | 85361010 |
| MXHTS | 8536.10.01 |



