TECHFUSE SMD0805-005-60V

Ihold is defined as the hold current — the maximum current at which the device will not trip in still air at 25°C; Itrip is defined as the trip current — the minimum current at which the device will always trip in still air at 25°C; Vmax is defined as the maximum voltage the device can withstand without damage at the rated current (Imax); Imax is defined as the maximum fault current the device can withstand without damage at the rated voltage (Vmax); Pd is defined as the power dissipation of the device in the tripped state at rated voltage, in still air at 25°C; Rimin/max is defined as the minimum/maximum resistance of the device prior to tripping at 25°C; R1max is defined as the maximum resistance of the device measured one hour after reflow soldering. Operating beyond the specified ratings may cause damage, arcing, and fire. Using a PTC beyond its maximum ratings or improper use may cause device damage, arcing, and fire. PTCs are intended to protect against occasional overcurrent or overtemperature fault conditions and should not be used where repeated fault conditions or prolonged trip events are anticipated. Handling the device inconsistently with the recommended electrical, thermal, and mechanical procedures will adversely affect device performance. Even if voltage imbalances in the circuit produce small voltages above the PTC's rated voltage, avoid restricting the thermal expansion of the PTC device, such as placing it under pressure or installing it in a confined space. Contamination of PTC materials by certain silicone-based oils or corrosive solvents will adversely affect device performance. PTC SMDs can be cleaned using standard methods. Customers are advised to follow the recommended pad layout and reflow profile. Improper board layout or reflow profile may adversely affect device solderability. Recommended reflow methods include infrared, vapor phase, and convection ovens; the device is not designed for wave soldering to the bottom of the board. The recommended maximum solder paste thickness is 0.25 mm (0.010 in). Devices can be cleaned using standard methods and solvents. If the reflow temperature exceeds the recommended profile, the device may not meet performance requirements. Storage conditions are a maximum of 40°C and 70% relative humidity; exceeding these storage conditions may result in the device failing to meet the specified performance.