MICROCHIP MCP23009T-E/SS

The MCP23X09 device provides 8-bit, general purpose parallel I/O expansion for I²C bus or SPI applications. The two devices differ only in the serial interface. The MCP23X09 consists of multiple 8-bit configuration registers for input, output and polarity selection. The system master can enable the I/Os as either inputs or outputs by writing the I/O configuration bits. The data for each input or output is kept in the corresponding input or output register. The polarity of the input port register can be inverted with the polarity inversion register. All registers can be read by the system master. The interrupt output can be configured to activate under two conditions (mutually exclusive):

1. When any input state differs from its corresponding input port register state. This is used to indicate to the system master that an input state has changed.
2. When an input state differs from a pre-configured register value (DEFVAL register). The Interrupt Capture register captures port values at the time of the Interrupt, thereby saving the condition that caused the Interrupt. The Power-On Reset (POR) sets the registers to their default values and initializes the device state machine. The hardware address pin is used to determine the device address.

• 8-Bit Remote Bidirectional I/O Port: I/O Pins Default to Input
• Open-Drain Outputs: 5.5V Tolerant, 25 mA Sink Capable (per Pin), 200 mA Total
• High-Speed I²C Interface (MCP23009): 100 kHz, 400 kHz, 3.4 MHz
• High-Speed SPI Interface (MCP23S09): 10 MHz
• Single Hardware Address Pin (MCP23009): Voltage input to allow up to eight devices on the bus
• Configurable Interrupt Output Pins: Configurable as active-high, active-low or open-drain
• Configurable Interrupt Source: Interrupt-on-Change from configured defaults or pin change
• Polarity inversion register to configure the polarity of the input port data
• External Reset Input
• Low Standby Current: 1 μA (-40°C ≤ TA ≤ +85°C), 6 μA (+85°C ≤ TA ≤ +125°C)
• Operating Voltage: 1.8V to 5.5V
• Available Packages: 16-Lead QFN (3×3×0.9 mm), 18-Lead PDIP (300 mil), 18-Lead SOIC (7.50 mm), 20-Lead SSOP (5.30 mm)