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MICROCHIP M7A3P1000-2PQG208 product image
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MICROCHIP M7A3P1000-2PQG208RoHS

Manufacturer
MPN
M7A3P1000-2PQG208
LCSC Part #
C6223443
Packaging
PQFP-208(28x28)
Customer #
Key Attributes
PQFP-208(28x28) FPGAs (Field Programmable Gate Array) RoHS
Datasheetpdf iconMICROCHIP M7A3P1000-2PQG208
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QtyUnit Price(Reference Only)Total Amount
1+$ 450.8511$ 450.85
192+$ 179.8932$ 34539.49
504+$ 173.882$ 87636.53
1,008+$ 170.9105$ 172277.78
Standard Packaging24/Full Tray
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/FPGAs (Field Programmable Gate Array)
ManufacturerMICROCHIP
PackagingPQFP-208(28x28)
Embedded Block RAM147456bit
Operating Temperature0℃~+85℃

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging24
Sales UnitPiece

Introduction

AI Translation

ProASIC3 is Actel's third-generation flash FPGA family, surpassing the ProASICPLUS family in performance, density, and features. The nonvolatile flash technology gives ProASIC3 devices the advantages of security, low power consumption, single-chip operation, and instant-on capability. The devices are reprogrammable and offer time-to-market advantages with ASIC-level unit costs. These features enable designers to create high-density systems using existing ASIC or FPGA design flows and tools. ProASIC3 devices provide 1 kbit of on-chip reprogrammable nonvolatile FlashROM memory, along with integrated PLL-based clock conditioning circuits. The A3P015 and A3P030 devices do not support PLL or RAM. ProASIC3 devices offer up to 1 M system gates.

Features

AI Translation
  • System gate capacity from 15 k to 1 M
  • Up to 144 kbit true dual-port SRAM
  • Up to 300 user I/Os
  • 130 nm, 7-layer metal (6-layer copper), flash-based CMOS process
  • Live-at-power-up Grade 0 support
  • Single-chip solution
  • Retains programmed design when powered down
  • 350 MHz system performance
  • 3.3 V, 66 MHz 64-bit PCI support
  • Secure in-system programming via JTAG (with on-chip 128-bit AES decryption, IEEE 1532 compliant)
  • FPGA content security protection via FlashLock
  • Low-power core voltage
  • System support down to 1.5 V
  • Low-impedance flash switches
  • Segmented, hierarchical routing and clock architecture
  • 700 Mbps DDR, LVDS-capable I/O support
  • 1.5 V, 1.8 V, 2.5 V, and 3.3 V mixed-voltage operation
  • Wide-range supply voltage per JESD8-B, I/O operation from 2.7 V to 3.6 V
  • Selectable I/O bank voltages — up to 4 banks per device
  • Single-ended I/O standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS 2.5 V / 5.0 V input
  • Differential I/O standards: LVPECL, LVDS, B-LVDS, and M-LVDS
  • I/O registers on input, output, and enable paths
  • Hot-swap and cold-spare I/O support
  • Programmable output slew rate and drive strength
  • Weak pull-up/pull-down
  • IEEE 1149.1 boundary scan test
  • Pin-compatible packages within ProASIC3 family
  • Six clock conditioning circuit blocks, one with integrated PLL
  • Configurable phase shift, multiply/divide, delay capability, and external feedback
  • Wide input frequency range
  • 1 kbit FlashROM user non-volatile memory
  • SRAM and FIFO with variable aspect ratio 4,608-bit RAM blocks
  • True dual-port SRAM
  • M1 and M7 ProASIC3 devices support Cortex-M1 and CoreMP7 soft processors, with or without debug