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MICROCHIP ATWINC1500-MR210PARoHS

Manufacturer
MPN
ATWINC1500-MR210PA
LCSC Part #
C5949020
Packaging
SMD-28P
Customer #
Key Attributes
SMD-28P RF Transceiver Modules and Modems RoHS
Datasheetpdf iconMICROCHIP ATWINC1500-MR210PA

Products Specifications

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TypeDescription
CategoryRF and Wireless/RF Transceiver Modules and Modems
ManufacturerMICROCHIP
PackagingSMD-28P

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging50
Sales UnitPiece

Introduction

AI Translation

The ATWINC1500-MR210PA is a low-power consumption 802.11 b/g/n IoT (Internet of Things) module which is specifically optimized for low power IoT applications. The highly integrated module features small form factor (21.5mm x 14.5mm x3.4mm) while fully integrating Power Amplifier, LNA, Switch, Power Management, and PCB antenna. With seamless roaming capabilities and advanced security, it could be interoperable with various vendors’ 802.11b/g/n Access Points in wireless LAN. The module provides SPI and UART to interface to host controller.

Features

AI Translation
  • IEEE 802.11 b/g/n 20MHz (1x1) solution
  • Single spatial stream in 2.4GHz ISM band
  • Integrated PA and T/R Switch
  • Integrated PCB antenna
  • Superior Sensitivity and Range via advanced PHY signal processing
  • Advanced Equalization and Channel Estimation
  • Advanced Carrier and Timing Synchronization
  • Wi-Fi Direct and Soft-AP support
  • Supports IEEE 802.11 WEP, WPA, WPA2 Security
  • Supports China WAPI security
  • Superior MAC throughput via hardware accelerated two-level A-MSDU/A-MPDU frame aggregation and block acknowledgement
  • On-chip memory management engine to reduce host load
  • SPI, UART, and I²C host interfaces
  • 2- or 3-wire Bluetooth coexistence interface
  • Operating temperature range of -40℃ to +85℃
  • I/O operating voltage of 2.7V to 3.6V
  • Integrated Flash memory for system software
  • Power Save Modes 4μA Deep Power Down mode typical @3.3V I/O 850μA Doze mode (Chip settings are preserved. Used for beacon monitoring mode)
  • On-chip low power sleep oscillator
  • Fast host wake-up from Doze mode by a pin or SPI transaction
  • Fast Boot Options On-Chip Boot ROM (Firmware instant boot) SPI flash boot (firmware patches and state variables)
  • Low-leakage on-chip memory for state variables
  • Fast AP Re-Association (150ms)
  • On-Chip Network Stack to offload MCU
  • Integrated Network IP stack to minimize host CPU requirements
  • Network features TCP, UDP, DHCP, ARP, HTTP, SSL, and DNS
  • Small footprint host driver (4KB flash – less than 1KB RAM)
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