Etron Tech EM638325TS-6G
| Manufacturer | |
| MPN | EM638325TS-6G |
| LCSC Part # | C5344834 |
| Packaging | TSOPII |
| Customer # | |
| Key Attributes | TSOPII Memory (ICs) RoHS |
| Datasheet |
Products Specifications
Show similar products (0) >| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Memory/Memory (ICs) | |
| Manufacturer | Etron Tech | |
| Packaging | TSOPII |
Additional Information
| Type | Details |
|---|---|
| Minimum | 1 |
| Multiple | 1 |
| Standard Packaging | 108 |
| Sales Unit | Piece |
| EDA Models | EasyEDA Model |
Introduction
The EM638325 SDRAM is a high-speed CMOS synchronous dynamic random access memory with a capacity of 64 Mbits. It is internally configured as four 512K x 32 DRAMs with a synchronous interface (all signals are registered on the rising edge of the clock signal CLK). Each 512K x 32-bit memory bank is organized as 2048 rows, 256 columns, and 32 bits. Read and write accesses to the SDRAM are burst-oriented; access begins at a selected location and continues for a programmed number of locations in a programmed sequence. Access begins with the registration of a BankActivate command, followed by a Read or Write command.
The EM638325 supports programmable read or write burst lengths of 1, 2, 4, 8, or full page, with a burst terminate option. Auto Precharge can be enabled to initiate a self-timed row precharge at the end of the burst sequence. Refresh operations (Auto Refresh or Self Refresh) are easy to use. Through a programmable mode register, the system can select the most suitable mode to maximize performance. These devices are ideal for applications requiring high memory bandwidth.
Features
- Fast access time: 5/5.4/5.4 ns
- Fast clock frequency: 200/166/143 MHz
- Fully synchronous operation
- Internal pipelined architecture
- Four internal banks (512K x 32-bit x 4 banks)
- Programmable mode - CAS latency: 2 or 3
- Burst length: 1, 2, 4, 8, or full page
- Burst type: sequential or interleaved
- Burst read - single write
- Burst stop function
- Individual byte control via DQM0-3
- Auto refresh and self-refresh
- Ambient temperature: 0~70 °C
- 4096 refresh cycles / 64ms
- Single +3.3V ± 0.3V supply
- Interface: LVTTL
- 86-pin 400 x 875 mil plastic TSOP II package - lead-free and halogen-free
- 90-ball 8 x 13 x 1.2mm FBGA package - lead-free and halogen-free
| Qty | Unit Price | Total Amount |
|---|---|---|
| 1+ | $ 2.1151 | $ 2.12 |
| 10+ | $ 2.0687 | $ 20.69 |
| 30+ | $ 2.0383 | $ 61.15 |
| 108+ | $ 2.0063 | $ 216.68 |
Standard Packaging108/Full Tray | ||
Products Specifications
Show similar products (0) >| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Memory/Memory (ICs) | |
| Manufacturer | Etron Tech | |
| Packaging | TSOPII |
Additional Information
| Type | Details |
|---|---|
| Minimum | 1 |
| Multiple | 1 |
| Standard Packaging | 108 |
| Sales Unit | Piece |
| EDA Models | EasyEDA Model |
Introduction
The EM638325 SDRAM is a high-speed CMOS synchronous dynamic random access memory with a capacity of 64 Mbits. It is internally configured as four 512K x 32 DRAMs with a synchronous interface (all signals are registered on the rising edge of the clock signal CLK). Each 512K x 32-bit memory bank is organized as 2048 rows, 256 columns, and 32 bits. Read and write accesses to the SDRAM are burst-oriented; access begins at a selected location and continues for a programmed number of locations in a programmed sequence. Access begins with the registration of a BankActivate command, followed by a Read or Write command.
The EM638325 supports programmable read or write burst lengths of 1, 2, 4, 8, or full page, with a burst terminate option. Auto Precharge can be enabled to initiate a self-timed row precharge at the end of the burst sequence. Refresh operations (Auto Refresh or Self Refresh) are easy to use. Through a programmable mode register, the system can select the most suitable mode to maximize performance. These devices are ideal for applications requiring high memory bandwidth.
Features
- Fast access time: 5/5.4/5.4 ns
- Fast clock frequency: 200/166/143 MHz
- Fully synchronous operation
- Internal pipelined architecture
- Four internal banks (512K x 32-bit x 4 banks)
- Programmable mode - CAS latency: 2 or 3
- Burst length: 1, 2, 4, 8, or full page
- Burst type: sequential or interleaved
- Burst read - single write
- Burst stop function
- Individual byte control via DQM0-3
- Auto refresh and self-refresh
- Ambient temperature: 0~70 °C
- 4096 refresh cycles / 64ms
- Single +3.3V ± 0.3V supply
- Interface: LVTTL
- 86-pin 400 x 875 mil plastic TSOP II package - lead-free and halogen-free
- 90-ball 8 x 13 x 1.2mm FBGA package - lead-free and halogen-free
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | |
| ECCN | - |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |
| Type | Details |
|---|---|
| RoHS | |
| ECCN | - |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| Type | Details |
|---|---|
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |

