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CRMICRO DPM10T60CG2RoHS

Manufacturer
CRMICROAsian Brands
MPN
DPM10T60CG2
LCSC Part #
C53435819
Packaging
DIP-25
Customer #
Key Attributes
DIP-25 Power Driver Modules RoHS
Datasheetpdf iconCRMICRO DPM10T60CG2
In-Stock: 44
44 In stock, ships now
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QtyUnit PriceTotal Amount
1+$ 4.6455$ 4.65
10+$ 4.0053$ 40.05
30+$ 3.6248$ 108.74
270+$ 3.241$ 875.07
540+$ 3.0637$ 1654.40
1,080+$ 2.983$ 3221.64
Standard Packaging270/Full Tube
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Products Specifications

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TypeDescription
CategoryDiscrete Semiconductors/Power Driver Modules
ManufacturerCRMICRO
PackagingDIP-25

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging270
Sales UnitPiece

Introduction

AI Translation

DPM10T60CG2 is a highly integrated, high-reliability three-phase BLDC motor driver circuit primarily designed for power motor drive applications. It incorporates 6 IGBTs and 3 half-bridge HVIC gate driver circuits. Integrated undervoltage protection, overcurrent protection, and SD enable shutdown functionality provide excellent protection and fail-safe operation. Since each phase has an independent negative DC terminal, the phase currents can be sensed individually. The circuit provides a temperature sense output port, and integrated bootstrap diodes simplify the peripheral circuitry.

Features

AI Translation
  • Integrated 3-phase half-bridge driver
  • Built-in 6 IGBTs
  • Built-in under-voltage protection
  • Built-in over-current protection
  • SD enable shutdown
  • Built-in bootstrap diodes
  • Fully compatible with 3.3V, 5V, and 15V MCU interfaces, active high
  • Temperature sensing function
  • 3 independent negative DC terminals for inverter current sensing applications
  • Package: DIP-25
  • Isolation level: 1500Vrms/min

Applications

AI Translation
  • Keep IPM input port traces as short as possible. Add RC filter circuits on gate input signals if necessary to prevent surge noise from incorrect inputs, but select RC values carefully
  • HIN and LIN have internal pull-down resistors; additional external pull-down resistors may be added if necessary
  • Connect an external pull-up resistor to VFO with an appropriate resistance value, and short all SD pins together in the application
  • To prevent surge damage, add a high-frequency non-inductive snubber capacitor between the IPM P terminal and the ground end of resistor RS, with connecting traces as short as possible
  • Add a filter capacitor significantly larger than bootstrap capacitor CBS at the VCC input; add a high-frequency filter capacitor for each VCC, placed as close to the pin as possible
  • Use a high-frequency capacitor C1 (greater than 2.2μF) as the bootstrap capacitor to absorb high-frequency ripple
  • Keep the trace between resistor RS and the IPM as short as possible to avoid IPM damage caused by surge voltage from trace inductance
  • Connect control ground and power ground at a single point, with traces as short as possible
  • In the short-circuit protection circuit, select RFCSC with a time constant of 1.5μs ~ 2μs, and keep all traces around RF and CSC as short as possible
  • Keep traces between VFO and SD as short as possible