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micron MTFC4GACAJCN-4M ITRoHS

Manufacturer
MPN
MTFC4GACAJCN-4M IT
LCSC Part #
C524859
Packaging
VFBGA-153(11.5x13)
Customer #
Key Attributes
4GB MLC eMMC 5.0 VFBGA-153(11.5x13) Memory (ICs) RoHS
Datasheetpdf iconmicron MTFC4GACAJCN-4M IT
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory (ICs)
Manufacturermicron
PackagingVFBGA-153(11.5x13)
Memory Size4GB
Operating temperature-40℃~+85℃
Reading Speed in Sequence160MB/S
Writing Speed in Sequence14MB/S
FeaturesBuilt-in wear leveling function;Bad block management function;ECC error correction function;Secure erase function;Hardware reset function
NAND Flash TypeMLC
NAND Stand-By Current35uA
Controller Stand-By Current230uA
InterfaceeMMC 5.0
NAND Operating Voltage (VCCF)2.7V~3.6V
Controller Operating Voltage (VCCQ)1.7V~1.95V;2.7V~3.6V

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging1000
Sales UnitPiece

Features

AI Translation
  • MultiMediaCard (MMC) controller and NAND Flash
  • 153-ball FBGA (RoHS compliant, "green package")
  • VCC: 2.7 - 3.6V
  • VCCQ (dual voltage): 1.7 - 1.95V; 2.7 - 3.6V
  • Industrial temperature ranges
    • Operating temperature: -40°C to +85°C
    • Storage temperature: -40°C to +85°C
  • JEDEC/MMC standard version 5.0-compliant (JEDEC Standard No. JESD84 - B50)
  • Advanced 12-signal interface
  • x1, x4, and x8 I/Os, selectable by host
  • SDR/DDR modes up to 52 MHz clock speed
  • HS200/HS400 modes
  • Real-time clock
  • Command classes: class 0 (basic); class 2 (block read); class 4 (block write); class 5 (erase); class 6 (write protection); class 7 (lock card)
  • Temporary write protection
  • Boot operation (high-speed boot)
  • Sleep mode
  • Replay-protected memory block (RPMB)
  • Secure erase and secure trim
  • Hardware reset signal
  • Multiple partitions with enhanced attribute
  • Permanent and power-on write protection
  • High-priority interrupt (HPI)
  • Background operation
  • Reliable write
  • Discard and sanitize
  • Extended partitioning
  • Context ID
  • Data TAG
  • Packed commands
  • Dynamic device capacity
  • Backward compatible with previous MMC
  • Cache
  • Field firmware update (FFU)
  • Device Health Report
  • Sleep notification
  • Power-off notification
  • ECC and block management implemented