Winbond W66DP2RQQAGJ

Manufacturer	WinbondAsian Brands
MPN	W66DP2RQQAGJ
LCSC Part #	C46681826
Packaging	TFBGA-200(10x14.5)
Customer #
Key Attributes	8Gbit 1.866GHz LPDDR4X SDRAM TFBGA-200(10x14.5) Memory (ICs) RoHS
Datasheet	Winbond W66DP2RQQAGJ

Products Specifications

Type	Description	All
Category	Integrated Circuits (ICs)/Memory/Memory (ICs)
Manufacturer	Winbond
Packaging	TFBGA-200(10x14.5)
Refresh Current	1mA
Voltage - Supply	1.06V~1.17V;1.7V~1.95V
Memory Size	8Gbit
Operating temperature	-40℃~+105℃
Clock Frequency	1.866GHz
Features	Auto self-refresh;Built-in temperature sensor;Auto precharge function;Asynchronous reset function;Data mask function;Write leveling function;ZQ calibration function;Dynamic on-chip termination
Memory Format	LPDDR4X SDRAM
Current - Supply	140mA

In-Stock: 2,160

2,160 In stock, ships now

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Qty	Unit Price	Total Amount
40+	$ 31.0647$ 30.4435	$ 1217.74
1,200+	$ 29.844$ 29.2472	$ 35096.64
Standard Packaging144/Full Tray

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Type	Description	All
Category	Integrated Circuits (ICs)/Memory/Memory (ICs)
Manufacturer	Winbond
Packaging	TFBGA-200(10x14.5)
Refresh Current	1mA
Voltage - Supply	1.06V~1.17V;1.7V~1.95V
Memory Size	8Gbit
Operating temperature	-40℃~+105℃
Clock Frequency	1.866GHz
Features	Auto self-refresh;Built-in temperature sensor;Auto precharge function;Asynchronous reset function;Data mask function;Write leveling function;ZQ calibration function;Dynamic on-chip termination
Memory Format	LPDDR4X SDRAM
Current - Supply	140mA