PSA FP55X334K631EFG
| Manufacturer | PSAAsian Brands |
| MPN | FP55X334K631EFG |
| LCSC Part # | C45354719 |
| Packaging | 2220 |
| Customer # | |
| Key Attributes | CAP CER 330nF 630V X7R 2220 |
| Datasheet |
Products Specifications
Show similar products (0) >| Type | Description | |
|---|---|---|
| Category | Passives/Capacitors/Ceramic Capacitors | |
| Manufacturer | PSA | |
| Packaging | 2220 | |
| Capacitance | 330nF | |
| Temperature Coefficient | X7R | |
| Tolerance | ±10% | |
| Voltage Rating | 630V |
Additional Information
| Type | Details |
|---|---|
| Minimum | 1 |
| Multiple | 1 |
| Standard Packaging | 1000 |
| Sales Unit | Piece |
| EDA Models | EasyEDA Model |
Introduction
POSPERITY Multilayer Ceramic Chip Capacitors supplied in bulk or tape & reel package are ideally suitable for thick-film hybrid circuits and automatic surface mounting on any printed circuit boards. The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations prevents the dissolution of termination when extended immersion in molten solder at elevated solder temperature.
| Qty | Unit Price | Total Amount |
|---|---|---|
| 1+ | $ 0.6485 | $ 0.65 |
| 10+ | $ 0.5429 | $ 5.43 |
| 30+ | $ 0.4908 | $ 14.72 |
| 100+ | $ 0.4388 | $ 43.88 |
| 500+ | $ 0.4063 | $ 203.15 |
| 1,000+ | $ 0.3901 | $ 390.10 |
Standard Packaging1000/Full Reel | ||
Products Specifications
Show similar products (0) >| Type | Description | |
|---|---|---|
| Category | Passives/Capacitors/Ceramic Capacitors | |
| Manufacturer | PSA | |
| Packaging | 2220 | |
| Capacitance | 330nF | |
| Temperature Coefficient | X7R | |
| Tolerance | ±10% | |
| Voltage Rating | 630V |
Additional Information
| Type | Details |
|---|---|
| Minimum | 1 |
| Multiple | 1 |
| Standard Packaging | 1000 |
| Sales Unit | Piece |
| EDA Models | EasyEDA Model |
Introduction
POSPERITY Multilayer Ceramic Chip Capacitors supplied in bulk or tape & reel package are ideally suitable for thick-film hybrid circuits and automatic surface mounting on any printed circuit boards. The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations prevents the dissolution of termination when extended immersion in molten solder at elevated solder temperature.
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | |
| ECCN | - |
| CNHTS | 8532241000 |
| USHTS | 8532240020 |
| TARIC | 8532240000 |
| CAHTS | 8532240090 |
| BRHTS | 85322410 |
| INHTS | 85322400 |
| MXHTS | 8532.24.01 |
| Type | Details |
|---|---|
| RoHS | |
| ECCN | - |
| CNHTS | 8532241000 |
| USHTS | 8532240020 |
| TARIC | 8532240000 |
| Type | Details |
|---|---|
| CAHTS | 8532240090 |
| BRHTS | 85322410 |
| INHTS | 85322400 |
| MXHTS | 8532.24.01 |



