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KUU K1206L300AR product image
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KUU K1206L300ARRoHS

Manufacturer
KUUAsian Brands
MPN
K1206L300AR
LCSC Part #
C41419556
Packaging
1206
Customer #
Key Attributes
PTC RESET FUSE 6V 3A 1206
Datasheetpdf iconKUU K1206L300AR
In-Stock: 3,345
3,345 In stock, ships now
Add to BOM List
QtyUnit PriceTotal Amount
5+$ 0.1038$ 0.52
50+$ 0.082$ 4.10
150+$ 0.0712$ 10.68
500+$ 0.063$ 31.50
3,500+$ 0.0565$ 197.75
7,000+$ 0.0532$ 372.40
Standard Packaging3500/Full Reel
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Products Specifications

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TypeDescription
CategoryCircuit Protection/PTC Resettable Fuses
ManufacturerKUU
Packaging1206
Operating Temperature-40℃~+85℃
Voltage - Max6V
Hold Current3A
Pitch-
Current - Max35A
Power Dissipation1W
Trip Current6A
Height1.6mm
Length3.6mm
Width1.9mm
Time to Trip(Max)4s
Resistance @ 25℃10mΩ
Resistance - Post Trip (R1) (Max)50mΩ
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Additional Information

TypeDetails
Minimum5
Multiple5
Standard Packaging3500
Sales UnitPiece

Features

AI Translation
  • V max = Maximum operating voltage the device can withstand without damage at rated current (Imax).
  • I max = Maximum fault current the device can withstand without damage at rated voltage (V max).
  • I hold = Hold current. Maximum current at which the device will not trip in still air at 25°C.
  • I trip = Trip current. Minimum current at which the device will always trip in still air at 25°C.
  • Pd = Power dissipation of the device in the tripped state in still air at 25°C under rated voltage.
  • Ri min/max = Minimum/maximum resistance of the device prior to tripping at 25°C.
  • R1max = Maximum device resistance measured one hour after reflow soldering.
  • Note: Operating beyond specified ratings may cause damage and may result in arcing and flame.
  • Recommended reflow methods: infrared, vapor phase, forced hot air, lead-free nitrogen atmosphere.
  • Recommended maximum solder paste thickness: 0.25mm.
  • Devices can be cleaned using standard industrial methods and solvents.
  • Terminal pad material: tin-plated nickel copper.
  • Terminal pad solderability: compliant with EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
  • Note: For this solder paste area, the recommended stencil thickness is approximately 0.12mm (if stencil thickness is insufficient, increase the solder paste area).