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MEMSIC MXC4005XC product image
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MEMSIC MXC4005XCRoHS

Manufacturer
MPN
MXC4005XC
LCSC Part #
C404327
Packaging
WLP-6(1.2x1.7)
Customer #
Key Attributes
Monolithic and Wafer Level Packaged Three-Axis Accelerometer
Datasheetpdf iconMEMSIC MXC4005XC
In-Stock: 235
235 In stock, ships now
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QtyUnit PriceTotal Amount
1+$ 0.6885$ 0.69
10+$ 0.5795$ 5.80
30+$ 0.5241$ 15.72
100+$ 0.4704$ 47.04
500+$ 0.4167$ 208.35
1,000+$ 0.4004$ 400.40
Standard Packaging3000/Full Reel
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Products Specifications

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TypeDescription
CategorySensors, Transducers/Motion Sensors/Accelerometers
ManufacturerMEMSIC
PackagingWLP-6(1.2x1.7)
Output Bits12bit
Accelerometer Sensing AxisX,Y,Z
Cache Size-
FeaturesMotion event detection
Standby Current1uA
Acceleration Measurement Range (MAX)±8g

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging3000
Sales UnitPiece

Introduction

AI Translation

The MEMSIC Three- Axis Thermal Accelerometer is based on MEMSIC's Proprietary thermal technology that is built with 0.18μm standard CMOS process and the most advanced Wafer Level Packaging. This device contains no moving sensor parts and thus eliminates field reliability and repeatability issues associated with competitive products. For example, there is no measurable resonance (immunity to vibration), no stiction, and no detectable hysteresis. It also eliminates the "click" sounds typically heard in ball based orientation sensors. Shock survival of the MEMS sensing structure is greater than 200,000g. This sensor provides X/Y/Z axis acceleration signals with very low 0g offset, and temperature signal with high accuracy. In addition, it detects six orientation positions, X/Y shake and shake directions. The MXC400xXC is the only monolithic and WLP three- axis accelerometer with smallest profile of 1.18mm×1.70mm×0.85mm that is perfectly suitable for mobile applications. It is available in operating temperature range of - 40°C to +85°C. The MXC400xXC provides I²C digital output with 400 KHz fast mode operation. And an interrupt pin (INT) is provided for orientation and X / Y shake detections. The device also has a power- down mode enabled through the I²C interface.

Features

AI Translation
  • Ultra Low Cost
  • Most Advantaged Technology in Industry
  • Monolithically-Integrated Single-Chip MEMS Sensor with On-Chip Signal Processing
  • MEMSIC Proprietary Technology with No Moving Parts
  • 200,000g Shock Survival Rating of Sensing Structure

  • 12-bit Signal Output for X, Y and Z Axes
  • Full Scale Range ±2g, ±4g and ±8g
  • 8-bit Temperature Output (-50°C to +100°C)
  • Smallest Wafer Level Package (WLP) Footprint 1.18mm × 1.70 mm × 0.85 mm
  • 6-Position Orientation Detection
  • Shake Detection with Interrupt
  • Programmable Shake Detection Threshold
  • I²C Slave, FAST (≤400KHz) Mode Interface
  • 1.8~3.6V Single Supply Continuous Operation
  • 1.8V Compatible I/O
  • Embedded Power Up/Down Mode
  • Eight I²C Addresses Pre-settable by User
  • RoHS Compliant

Applications

AI Translation
  • Information Appliances
  • Cell Phones, Tablets, PDA's, Computer Peripherals
  • LCD Projectors, Pedometers, DSC/DVC, MP3/MP4
  • Gaming
  • Joystick, Toys
  • Household Safety
  • Heating Fan, Iron, Cooling Fan