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Winbond W632GU6RB-11 product image
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Winbond W632GU6RB-11RoHS

Manufacturer
WinbondAsian Brands
MPN
W632GU6RB-11
LCSC Part #
C39979278
Packaging
VFBGA-96(7.5x13)
Customer #
Key Attributes
1.283V~1.45V 2Gbit 933MHz DDR3L SDRAM VFBGA-96(7.5x13) Memory (ICs) RoHS
Datasheetpdf iconWinbond W632GU6RB-11
In-Stock: 1,448
1,448 In stock, ships now
Add to BOM List
QtyUnit PriceTotal Amount
1+$ 13.3862$ 13.39
10+$ 11.5705$ 115.71
30+$ 10.4638$ 313.91
100+$ 9.5348$ 953.48
Standard Packaging198/Full Tray
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory (ICs)
ManufacturerWinbond
PackagingVFBGA-96(7.5x13)
Refresh Current-
Voltage - Supply1.283V~1.45V
Memory Size2Gbit
Operating temperature0℃~+95℃
Clock Frequency933MHz
FeaturesAuto self-refresh;Auto precharge function;Data mask function;Write leveling function;ZQ calibration function;Asynchronous reset function;Dynamic on-chip termination
Memory FormatDDR3L SDRAM
Current - Supply-
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Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging198
Sales UnitPiece

Introduction

AI Translation

This device is a 16M×8 banks×16-bit DDR3L SDRAM operating at 1.35V (VDD) and 1.35V/1.5V (VDDQ) supply voltages, providing high-speed data transfer with a maximum operating clock frequency of 800MHz and a data rate of 1600Mbps/pin. It is housed in a 78-ball FBGA package, supporting 1.5V I/O (DDR3 compatible) and 1.35V I/O (DDR3L). Designed for applications requiring high speed, high bandwidth, and low power consumption, it offers programmable read/write burst lengths (BL8 or BC4/OTF) and programmable CAS latency (5, 6, 7, 8, 9, 10, 11, 12, 13, 14). It features programmable drive strength and on-die termination (ODT), with dynamic ODT and write leveling support to optimize signal integrity. The device supports auto refresh and self-refresh modes, as well as ZQ calibration commands to compensate for process, voltage, and temperature (PVT) variations. Operating temperature ranges cover commercial grade (0℃ ~ 95℃) and industrial grade (-40℃ ~ 95℃).

Features

AI Translation
  • High-speed data transfer: clock frequency up to 800MHz, data rate up to 1600Mbps/pin
  • Low power consumption: 1.35V VDD and 1.35V/1.5V VDDQ supply voltage
  • High density: 16M×8 banks×16-bit organization
  • Programmable burst length: BL8 or BC4/OTF supported
  • Programmable CAS latency: CL = 5, 6, 7, 8, 9, 10, 11, 12, 13, 14 supported
  • Programmable drive strength and on-die termination (ODT)
  • Dynamic ODT and write leveling supported
  • Auto refresh and self-refresh modes supported
  • ZQ calibration for PVT variation compensation
  • Operating temperature range: commercial grade 0℃ ~ 95℃, industrial grade -40℃ ~ 95℃