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BOURNS 2036-35-B3LF product image
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BOURNS 2036-35-B3LFRoHS

Manufacturer
MPN
2036-35-B3LF
LCSC Part #
C3661219
Packaging
Through Hole
Customer #
Key Attributes
GDT 350V 10kA 3 POLE TH
Datasheetpdf iconBOURNS 2036-35-B3LF
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QtyUnit Price(Reference Only)Total Amount
1+$ 1.0551$ 1.06
200+$ 0.4088$ 81.76
500+$ 0.3949$ 197.45
1,000+$ 0.3872$ 387.20
Standard Packaging100/Full Box
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Products Specifications

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TypeDescription
CategoryCircuit Protection/Gas Discharge Tube Arresters (GDT)
ManufacturerBOURNS
PackagingThrough Hole
Impulse Discharge Current10kA
Tolerance±20%
Voltage - DC Spark Over (Nom)350V
Number of Poles3

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging100
Sales UnitPiece

Features

AI Translation
  • Diameter 5 mm, length 7.5 mm
  • UL recognized
  • RoHS-compliant models available
  • Test methods compliant with ITU-T K.12, IEEE C62.31, and IEC 61643-311 GDT standards
  • Pulse sparkover voltage defined as typical distribution value
  • Pulse transverse delay: <75 ns at 1000 V/µs
  • Insulation resistance: >10^10 Ω at 100 V (50 V for models 2036-07 and 2036-09)
  • DC sparkover voltage: ~70 V at 10 mA
  • Arc voltage: ~10 V at 1 A
  • Glow-to-arc transition current: <0.5 A
  • Capacitance: <2 pF at 1 MHz
  • DC holdover voltage: <150 ms at 135 V (52 V for models 2036-07 and 2036-09; 80 V for model 2036-15)
  • Impulse discharge current: 20000 A, 8/20 µs waveform, minimum 1 operation; 10000 A, 8/20 µs waveform, >10 operations; 2000 A, 10/350 µs waveform, 1 operation; 200 A, 10/1000 µs waveform, >300 operations; 200 A, 10/700 µs waveform, >500 operations
  • AC discharge current: 20 Arms, 11 cycles, 1 operation; 10 Arms, 1 second, >10 operations
  • Storage temperature: -55 to +105 °C
  • Operating temperature: -55 to +105 °C
  • Climatic category (IEC 60068-1): 55/105/21
  • ESD class (HBM): 6
  • Optional switching-class fail-short device available
  • Optional fail-short component activates at 215 °C to 217 °C, providing a highly conductive ground path under thermal overload conditions
  • GDTs with optional fail-short device should be hand-soldered below the fail-short mechanism activation temperature, or using a selective soldering process not exceeding 210 °C

Applications

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  • Telecom
  • Industrial Electronics
  • Commercial Electronics
  • Consumer Electronics