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BOURNS 2036-35-B3FLF product image
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BOURNS 2036-35-B3FLFRoHS

Manufacturer
MPN
2036-35-B3FLF
LCSC Part #
C3661208
Packaging
Through Hole
Customer #
Key Attributes
GDT 350V 10kA 3 POLE TH
Datasheetpdf iconBOURNS 2036-35-B3FLF
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QtyUnit Price(Reference Only)Total Amount
1+$ 1.4007$ 1.40
200+$ 0.543$ 108.60
500+$ 0.523$ 261.50
1,000+$ 0.5137$ 513.70
Standard Packaging100/Full Box
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Products Specifications

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TypeDescription
CategoryCircuit Protection/Gas Discharge Tube Arresters (GDT)
ManufacturerBOURNS
PackagingThrough Hole
Impulse Discharge Current10kA
Tolerance±20%
Voltage - DC Spark Over (Nom)350V
Number of Poles3

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging100
Sales UnitPiece

Introduction

AI Translation

Balanced Mini-TRIGARD™ gas discharge tube, 5 mm diameter, 7.5 mm length. UL certified with RoHS-compliant versions available.

Features

AI Translation
  • Impulse spark-over voltage defined as typical value of distribution.
  • Impulse transverse delay: 1000 V/μs, less than 75 ns.
  • Insulation resistance: 100 V (50 V for models 2036–07 and 2036-09), greater than 10¹⁰ Ω.
  • Glow voltage: 10 mA, approx. 70 V.
  • Arc voltage: 1 A, approx. 10 V.
  • Glow-to-arc transition current: less than 0.5 A.
  • Capacitance: 1 MHz.
  • DC holdover voltage: 135 V (52 V for models 2036-07 and 2036-09, 80 V for model 2036-15), less than 150 ms.
  • Impulse discharge current: 20000 A, 8/20 μs, minimum 1 operation; 10000 A, 8/20 μs, greater than 10 operations; 2000 A, 10/350 μs, 1 operation; 200 A, 10/1000 μs, greater than 300 operations; 200 A, 10/700 μs, greater than 500 operations.
  • AC discharge current: 20 Arms, 1 s, minimum 1 operation; 10 Arms, 1 s, greater than 10 operations.
  • Storage temperature: -55 to +105 °C.
  • Operating temperature: -55 to +105 °C.
  • Climatic category (IEC 60068-1): 55/105/21.
  • Moisture sensitivity level.
  • ESD classification (HBM): 6.
  • Optional fail-short device available. This optional fail-short component activates at a temperature of 215 °C – 217 °C, providing a highly conductive path to ground under thermal overload conditions. GDTs equipped with the optional fail-short device should be hand-soldered at temperatures below the fail-short mechanism activation temperature, or using a selective soldering process not exceeding 210 °C.

Applications

AI Translation
  • Telecom
  • Industrial Electronics
  • Commercial Electronics
  • Consumer Electronics