LCSC Electronics logoLCSC Electronics svg logo
Sign In
USD
Winbond W634GU6RB-11 product image
  • W634GU6RB-11 thumbnail 1
  • W634GU6RB-11 thumbnail 2
  • W634GU6RB-11 thumbnail 3
  • Pinout Diagram
  • Footprint Diagram
Images for reference only

Winbond W634GU6RB-11RoHS

Manufacturer
WinbondAsian Brands
MPN
W634GU6RB-11
LCSC Part #
C29801372
Packaging
VFBGA-96(13x7.5)
Customer #
Key Attributes
1.283V~1.45V 4Gbit 933MHz DDR3L SDRAM VFBGA-96(13x7.5) Memory (ICs) RoHS
Datasheetpdf iconWinbond W634GU6RB-11
In-Stock: 2,896
2,896 In stock, ships now
Add to BOM List
QtyUnit PriceTotal Amount
16+$ 17.5959$ 281.53
160+$ 16.9934$ 2718.94
480+$ 15.9512$ 7656.58
1,600+$ 15.0425$ 24068.00
Standard Packaging198/Full Tray
Better price for more quantity?
$

Products Specifications

Show similar products (0) >
TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory (ICs)
ManufacturerWinbond
PackagingVFBGA-96(13x7.5)
Refresh Current-
Voltage - Supply1.283V~1.45V
Memory Size4Gbit
Operating temperature-40℃~+95℃
Clock Frequency933MHz
FeaturesAuto self-refresh;Auto precharge function;Data mask function;Write leveling function;ZQ calibration function;Asynchronous reset function;Dynamic on-chip termination
Memory FormatDDR3L SDRAM
Current - Supply-

Additional Information

TypeDetails
Minimum16
Multiple16
Standard Packaging198
Sales UnitPiece

Introduction

AI Translation

Winbond W631GU6NB-11 is a 1.5V, 512Mbit low-power double data rate 3L synchronous dynamic random access memory (DDR3L SDRAM) device. The device is internally configured as 8 banks with 16-bit I/O, organized as 32M × 8 banks × 16 bits. It employs a double data rate architecture for high-speed operation. This double data rate architecture is essentially an 8n-prefetch architecture, with an interface designed to transfer two data words per clock cycle at the I/O pins. For DDR3L SDRAM, a single read or write access consists of an 8n-bit wide, one-clock-cycle data transfer at the internal DRAM core, and eight corresponding n-bit wide, half-clock-cycle data transfers at the I/O pins. The device is designed to comply with key DDR3L DRAM features such as posted CAS# with additive latency, write latency equal to read latency minus 1, on-die termination (ODT), and dynamic ODT for write operations. All control and address inputs are synchronous to a pair of externally supplied differential clocks. Inputs are latched at the crossing point of the differential clock (rising edge of CK and falling edge of CK#). All I/O are synchronous to a pair of bidirectional differential data strobes (DQS, DQS#), which are edge-aligned with data during reads and center-aligned with data during writes. The device supports the following features: programmable CAS latency, programmable additive latency, programmable burst length (BL8, BC4, and BC4 via mode register set (MRS)), and programmable partial array self-refresh (PASR).

Features

AI Translation
  • Supply voltage VDD = VDDQ = 1.5V ±0.075V
  • 8n-bit prefetch architecture
  • Differential clock inputs (CK, CK#)
  • Differential data strobe (DQS, DQS#)
  • Data strobe (DQS, DQS#) edge-aligned with data during reads, center-aligned during writes
  • Data Mask (DM) masks data during writes
  • All address and control inputs latched at the crossing of CK and CK#
  • Programmable CAS Latency: 5, 6, 7, 8, 9, 10, 11, 12, 13, 14
  • Programmable Additive Latency: 0, CL-1, CL-2
  • Programmable Burst Length: 8, 4 (via BC4 or BL8 mode)
  • Programmable Partial Array Self-Refresh (PASR)
  • Auto Self-Refresh (ASR) and Self-Refresh Temperature (SRT)
  • Dynamic ODT (Rtt_WR) support
  • Programmable output driver impedance (RZQ/7, RZQ/6, RZQ/5)
  • Programmable ODT impedance (RZQ/6, RZQ/7, RZQ/4, RZQ/2, disabled)
  • Programmable Write Recovery (WR)
  • Programmable CWL: 5, 6, 7, 8, 9, 10, 11, 12, 13, 14
  • Programmable DLL reset
  • Programmable DLL enable/disable
  • Programmable output disable
  • Programmable Multi-Purpose Register (MPR)
  • Programmable test mode
  • Programmable precharge powerdown DLL
  • Programmable write leveling
  • Programmable ZQ calibration
  • Programmable reset
  • Programmable initialization
  • Programmable mode register
  • Programmable command truth table
  • Programmable CKE truth table
  • Programmable simplified state diagram
  • Programmable electrical characteristics
  • Programmable maximum ratings
  • Programmable operating temperature conditions
  • Programmable DC and AC operating conditions
  • Programmable recommended DC operating conditions
  • Programmable input and output leakage current
  • Programmable interface test conditions
  • Programmable DC and AC input measurement levels
  • Programmable DC and AC input levels (single-ended command and address signals)
  • Programmable DC and AC input levels (single-ended data signals)
  • Programmable differential swing requirements (clock (CK - CK#) and strobe (DQS - DQS#))
  • Programmable single-ended requirements for differential signals
  • Programmable differential input crosspoint voltage
  • Programmable slew rate definition for single-ended input signals
  • Programmable slew rate definition for differential input signals
  • Programmable DC and AC output measurement levels
  • Programmable output slew rate definitions and requirements
  • Programmable single-ended output slew rate
  • Programmable differential output slew rate
  • Programmable output driver DC electrical characteristics
  • Programmable output driver temperature and voltage sensitivity
  • Programmable ODT levels and characteristics
  • Programmable ODT levels and I-V characteristics
  • Programmable ODT DC electrical characteristics
  • Programmable ODT temperature and voltage sensitivity
  • Programmable RTTPU and RTTPD design guidelines
  • Programmable ODT timing definitions