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TI TPA701DGNR product image
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TI TPA701DGNRRoHS

Manufacturer
MPN
TPA701DGNR
LCSC Part #
C2879175
Packaging
HVSSOP-8
Customer #
Key Attributes
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
Datasheetpdf iconTI TPA701DGNR
In-Stock: 100
100 In stock, ships now
Add to BOM List
QtyUnit PriceTotal Amount
1+$ 4.0829$ 4.08
200+$ 1.7726$ 354.52
500+$ 1.7213$ 860.65
1,000+$ 1.696$ 1696.00
Standard Packaging2500/Full Reel
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Linear/Amplifiers/Audio Amplifiers
ManufacturerTI
PackagingHVSSOP-8
Quiescent Current2.5mA
Total Harmonic Distortion + Noise (THD+N)0.5%
Number of Inputs-
Signal-to-Noise Ratio-
FeaturesEnable/shutdown function
Speaker Channels1-Channel
Voltage - Supply2.5V~5.5V
Efficiency-
Operating Temperature-40℃~+85℃
Output Power700mWx1@8Ω
Class-
Power Supply Rejection Ratio (PSRR)85dB

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging2500
Sales UnitPiece

Introduction

AI Translation

The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of continuous power into a BTL 8-Ω load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

Features

AI Translation
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5V - 5.5V
  • Output Power for RL = 8 Ω:
    • ~700 mW at VDD = 5 V, BTL
    • ~250 mW at VDD = 3.3 V, BTL
  • Ultralow Quiescent Current in Shutdown Mode... 1.5 nA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging:
    • SOIC
    • PowerPAD MSOP