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TI SN74ABT16244ADLR product image
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TI SN74ABT16244ADLRRoHS

Manufacturer
TI
MPN
SN74ABT16244ADLR
LCSC Part #
C2869608
Packaging
SSOP-48-300mil
Customer #
Key Attributes
16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
Datasheetpdf iconTI SN74ABT16244ADLR
In-Stock: 85
85 In stock, ships now
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QtyUnit PriceTotal Amount
1+$ 2.2435$ 2.24
10+$ 1.9767$ 19.77
30+$ 1.7862$ 53.59
100+$ 1.6147$ 161.47
500+$ 1.5353$ 767.65
1,000+$ 1.502$ 1502.00
Standard Packaging1000/Full Reel
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Logic/Buffers, Drivers, Receivers, Transceivers
ManufacturerTI
PackagingSSOP-48-300mil
Input type-
Current - Output High(IOH)32mA
Series74ABT
Voltage - Supply4.5V~5.5V
Operating Temperature-40℃~+85℃
Output TypeTri-State
Current - Output Low(IOL)64mA
Number of Bits per Element4
Channel TypeUnidirectional
FeaturesOutput enable
Number of Elements4
Quiescent Current3mA
Propagation Delay2.3ns@5V,50pF
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Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging1000
Sales UnitPiece

Introduction

AI Translation

The SN54ABT16244 and SN74ABT16244A are 16-bit buffers and line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and symmetrical OE (active-low output-enable) inputs.

To ensure the high-impedance state during power up or power down, OE(overline) should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74ABT16244A is characterized for operation from -40℃ to 85℃.

Features

AI Translation
  • Members of the Texas Instruments Widebus™Family
  • State-of-the-Art EPIC-IIB™BiCMOS Design
  • Significantly Reduces Power Dissipation
  • Latch-Up Performance Exceeds 500 mA Per JESD 70
  • Typical vₒₗₚ (Output Ground Bounce) < 1 V at VCC = 5 V, Tₐ = 25℃
  • Distributed VCC and GND Pin Configuration
  • Minimizes High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • High-Drive Outputs (-32 mA Iₒₕ, 64 mA Iₒₗ)
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings