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TI SN74ABTR2245PWR product image
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TI SN74ABTR2245PWRRoHS

Manufacturer
MPN
SN74ABTR2245PWR
LCSC Part #
C2869347
Packaging
TSSOP-20
Customer #
Key Attributes
OCTAL TRANSCEIVERS AND LINE/MEMORY DRIVERS WITH 3-STATE OUTPUTS
Datasheetpdf iconTI SN74ABTR2245PWR
In-Stock: 89
89 In stock, ships now
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QtyUnit PriceTotal Amount
1+$ 0.874$ 0.87
10+$ 0.8546$ 8.55
30+$ 0.8416$ 25.25
100+$ 0.8286$ 82.86
Standard Packaging2000/Full Reel
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Logic/Buffers, Drivers, Receivers, Transceivers
ManufacturerTI
PackagingTSSOP-20
Input type-
Voltage - Supply4.5V~5.5V
Output TypeTri-State
Current - Output High(IOH)12mA
Series74ABTR
Operating Temperature-40℃~+85℃
Current - Output Low(IOL)12mA
Number of Bits per Element8
Channel TypeBidirectional
FeaturesPower-off isolation;Output enable
Number of Elements1
Quiescent Current-
Propagation Delay-

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging2000
Sales UnitPiece

Introduction

AI Translation

These octal transceivers and line drivers are designed for asynchronous communication between data buses. The devices transmit data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE(overline)) input can be used to disable the device so the buses are effectively isolated.

Both the A-port and B-port outputs, which are designed to sink up to 12 mA, include equivalent 25-Ω series resistors to reduce overshoot and undershoot.

When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OC(overline) should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Features

AI Translation
  • Outputs Have Equivalent 25-Ω Series Resistors, So No External Resistors Are Required
  • State-of-the-Art EPIC-IIB BiCMOS Design Significantly Reduces Power Dissipation
  • High-Impedance State During Power Up and Power Down
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • ESD Protection Exceeds 2000 V Per MIL-STD-833, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Typical vOLP (Output Ground Bounce) < 1 V at Vcc = 5 V, TA = 25℃
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Thin Very Small-Outline (DGV) Packages, Ceramic Chip Carriers (FK), and Plastic (N) and Ceramic (J) DIPs

Applications

AI Translation
  • Data transfer between asynchronous communication data buses