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TI SN74ABT16241ADGGR product image
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TI SN74ABT16241ADGGRRoHS

Manufacturer
TI
MPN
SN74ABT16241ADGGR
LCSC Part #
C2867564
Packaging
TSSOP-48-6.1mm
Customer #
Key Attributes
4.5V~5.5V 16 1 2.7ns@5V,50pF 3mA TSSOP-48-6.1mm Buffers, Drivers, Receivers, Transceivers RoHS
Datasheetpdf iconTI SN74ABT16241ADGGR
In-Stock: 50
50 In stock, ships now
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QtyUnit PriceTotal Amount
1+$ 1.0596$ 1.06
10+$ 1.0343$ 10.34
30+$ 1.0184$ 30.55
100+$ 1.0025$ 100.25
Standard Packaging2000/Full Reel
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Logic/Buffers, Drivers, Receivers, Transceivers
ManufacturerTI
PackagingTSSOP-48-6.1mm
Input type-
Current - Output High(IOH)32mA
Voltage - Supply4.5V~5.5V
SeriesABT
Operating Temperature-40℃~+85℃
Output TypeTri-State
Current - Output Low(IOL)64mA
Number of Bits per Element16
Channel TypeUnidirectional
FeaturesOutput enable
Number of Elements1
Propagation Delay2.7ns@5V,50pF
Quiescent Current3mA
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Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging2000
Sales UnitPiece

Features

AI Translation
  • State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation
  • Typical VOLP (Output Ground Bounce) < 1 V at Vcc = 5 V, TA = 25 ℃
  • Distributed Vcc and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • High-Drive Outputs (–32-mA IOH, 64-mA IOL)
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model Δ'C = 200 pF, R̃ = 0
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings