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TI DS90LV027AQMAX/NOPB product image
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TI DS90LV027AQMAX/NOPBRoHS

Manufacturer
MPN
DS90LV027AQMAX/NOPB
LCSC Part #
C2866391
Packaging
SOIC-8
Customer #
Key Attributes
DS90LV027AQ Automotive LVDS Dual Differential Driver
Datasheetpdf iconTI DS90LV027AQMAX/NOPB
In-Stock: 42
42 In stock, ships now
Add to BOM List
QtyUnit PriceTotal Amount
1+$ 2.0101$ 2.01
10+$ 1.7057$ 17.06
30+$ 1.5153$ 45.46
100+$ 1.32$ 132.00
500+$ 1.2321$ 616.05
1,000+$ 1.1947$ 1194.70
Standard Packaging2500/Full Reel
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Interface/Drivers, Receivers, Transceivers
ManufacturerTI
PackagingSOIC-8
TypeDriver
Voltage - Supply3V~3.6V
Data Rate600Mbps
Operating Temperature-40℃~+125℃
Number of Drivers2
FeaturesLow power standby / automatic shutdown on failure
Level StandardLVDS
Number of Receivers0

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging2500
Sales UnitPiece

Introduction

AI Translation

The DS90LV027AQ is a dual LVDS driver device optimized for high data rate and low power applications. The device is designed to support data rates in excess of 600Mbps (300MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. The DS90LV027AQ is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized. The device is in a 8- lead SOIC package. The DS90LV027AQ has a flow- through design for easy PCB layout. The differential driver outputs provides low EMI with its typical low output swing of 360 mV. It is perfect for high speed transfer of clock and data. The DS90LV027AQ can be paired with its companion dual line receiver, the DS90LV028AQ, or with any of TI's LVDS receivers, to provide a high- speed point- to- point LVDS interface.

Features

AI Translation
  • AECQ-100 Grade 1
  • 600 Mbps (300MHz) Switching Rates

  • 0.3 ns Typical Differential Skew
  • 0.7 ns Maximum Differential Skew
  • 3.3V Power Supply Design
  • Low Power Dissipation (46 mW @ 3.3V Static)
  • Flow-Through Design Simplifies PCB Layout
  • Power Off Protection (Outputs in High Impedance)
  • Conforms to TIA/EIA-644 Standard
  • 8-Lead SOIC Package Saves Space