ADI ADSD3500BCBZRL7

A Time-of-Flight (ToF) Depth Image Signal Processor (ISP) processes the raw phase frames from the ToF imager, generating the final radial depth, active brightness (AB), and confidence frames. It supports full computation of depth, active brightness and confidence data for 640×512 resolution and partial depth computation (pre-phase unwrap) for 1024×1024 resolution. Data and processing flow is controlled using the integrated ARM Cortex-M33. Computation is performed using dedicated hardware and memory, enabling a low-power ToF depth ISP solution. It also controls the boot-up of the image sensor module, loading of calibration data, and triggering of frames. The image data receiver (RX) and transmitter (TX) ports use standard Mobile Industry Processor Interface (MIPI) Camera Serial Link 2 (CSI-2) interfaces. Processor programming and operation are controlled through a 4-wire quad serial peripheral interface (QSPI), Inter-Integrated Circuit (I2C), and Improved Inter-Integrated Circuit (I3C) serial interfaces. It is available in a 3.47mm×3.47mm Wafer-level chip scale packaging (WLCSP) and is specified over an operating temperature range of -25°C to +85°C.

• Depth processor for Time-of-Flight imagers
• Full-depth processing at 640×512 resolution, up to 90 frames per second (FPS)
• Partial depth processing at 1024×1024 resolution, up to 30 FPS
• On-chip static random access memory (SRAM) for frame buffering and manipulation
• Arm Cortex-M33 processor for data flow control
• 4-lane MIPI CSI-2 receiver interface, 2.5 Gbps per lane
• 2-lane MIPI CSI-2 transmitter interface, 2.5 Gbps per lane
• I2C Controller and Target (1 MHz), I3C Target (12.5 MHz)
• QSPI Controller (50MHz) and Target (30 MHz)
• 22 GPIO for external connectivity
• Crystal oscillator (24 MHz) or external clock (24 MHz, 19.2 MHz)
• 1.8V I/O supply, 0.8V core supply
• 3.47mm×3.47mm WLCSP with 9×9 ball array

• Augmented reality (AR) systems
• Robotics
• Building automation
• Machine vision systems