TI SN74LVC2G240DCUR

This dual buffer driver is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC2G240 device is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is organized as two 1-bit buffers/drivers with separate output-enable (OE(overline)) inputs. When OE(overline) is low, the device passes data from the A input to the Y output. When OE is high, the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE(overline) should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

• Available in the Texas Instruments NanoFree™ Package
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 4.6 ns at 3.3 V
• Low Power Consumption, 10 μA Max ICC
• ±24 mA Output Drive at 3.3 V
• Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3V, TA = 25℃
• Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3V, TA = 25℃
• Ioff Supports Live Insertion, Partial-Power Down Mode, and Back-Drive Protection
• Can Be Used as a Down Translator to Translate Inputs From a Max of 5.5 V Down to the VCC Level
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 1000-V Charged-Device Model (C101)