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RENESAS SLG46536V-DIP
| Manufacturer | |
| MPN | SLG46536V-DIP |
| LCSC Part # | C21826992 |
| Packaging | - |
| Customer # | |
| Key Attributes | Embedded Complex Logic (FPGA, CPLD) Evaluation Boards RoHS |
| Datasheet |  RENESAS SLG46536V-DIP |
Products Specifications
Show similar products (0) >| Type | Description | |
|---|---|---|
| Category | Development Boards, Kits, Programmers/Evaluation Boards/Embedded Complex Logic (FPGA, CPLD) Evaluation Boards | |
| Manufacturer | RENESAS | |
| Packaging | - |
Report an ErrorShow similar products (0) >
Additional Information
| Type | Details |
|---|---|
| Minimum | 1 |
| Multiple | 1 |
| Standard Packaging | 3000 |
| Sales Unit | Piece |
| EDA Models | EasyEDA Model |
Introduction
AI Translation
The GreenPAK DIP Adapter is a small PCB that converts an STQFN package to a DIP package. This board accelerates design prototyping and testing. The 0.43×1.03-inch board features a 20-pin, 0.3-inch-wide DIP package. You can also use this adapter for prototyping, making the STQFN package compatible with solderless breadboards.
Features
AI Translation
- Low cost
- Simplified prototyping for SMT ICs
- Optional VDD LED indicator
- Decoupling capacitors included
- Optional I²C pull-up resistors
In-Stock: 3
3 In stock, ships now
Add to BOM List
| Qty | Unit Price | Total Amount |
|---|---|---|
| 1+ | $ 10.9778 | $ 10.98 |
| 10+ | $ 10.6348 | $ 106.35 |
Standard Packaging3000/Full Reel | ||
Better price for more quantity?
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Products Specifications
Show similar products (0) >| Type | Description | |
|---|---|---|
| Category | Development Boards, Kits, Programmers/Evaluation Boards/Embedded Complex Logic (FPGA, CPLD) Evaluation Boards | |
| Manufacturer | RENESAS | |
| Packaging | - |
Report an ErrorShow similar products (0) >
Additional Information
| Type | Details |
|---|---|
| Minimum | 1 |
| Multiple | 1 |
| Standard Packaging | 3000 |
| Sales Unit | Piece |
| EDA Models | EasyEDA Model |
Introduction
AI Translation
The GreenPAK DIP Adapter is a small PCB that converts an STQFN package to a DIP package. This board accelerates design prototyping and testing. The 0.43×1.03-inch board features a 20-pin, 0.3-inch-wide DIP package. You can also use this adapter for prototyping, making the STQFN package compatible with solderless breadboards.
Features
AI Translation
- Low cost
- Simplified prototyping for SMT ICs
- Optional VDD LED indicator
- Decoupling capacitors included
- Optional I²C pull-up resistors
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | |
| ECCN | EAR99 |
| CNHTS | 8542319090 |
| USHTS | |
| TARIC | |
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS |
| Type | Details |
|---|---|
| RoHS | |
| ECCN | EAR99 |
| CNHTS | 8542319090 |
| USHTS | |
| TARIC |
| Type | Details |
|---|---|
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS | |