LCSC Electronics logoLCSC Electronics svg logo
Sign In
USD
Cart
MICROCHIP AT24C32D-MAHM-E product image
Images for reference only

MICROCHIP AT24C32D-MAHM-ERoHS

Manufacturer
MICROCHIP
MPN
AT24C32D-MAHM-E
LCSC Part #
C2061262
Packaging
DFN-8-EP(2x3)
Customer #
Key Attributes
32-Kbit I²C-Compatible Serial EEPROM
Datasheetpdf iconMICROCHIP AT24C32D-MAHM-E
In-Stock: 96
96 In stock, ships now
Add to BOM List
QtyUnit PriceTotal Amount
1+$ 0.8159$ 0.82
10+$ 0.7964$ 7.96
30+$ 0.785$ 23.55
100+$ 0.772$ 77.20
Standard Packaging15000/Full Reel
Better price for more quantity?
$

Products Specifications

Show similar products (0) >
TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory (ICs)
ManufacturerMICROCHIP
PackagingDFN-8-EP(2x3)
Memory Size32Kbit
Voltage - Supply1.7V~5.5V
Operating temperature-40℃~+85℃
Clock Frequency1MHz
FeaturesNoise suppression function;Hardware write protection function;Built-in power-on reset (POR)
Data Retention - TDR (Year)100 Years
Write Cycle Time(tWC)5ms
Write Cycle Endurance1,000,000 cycles
InterfaceI2C
Report an ErrorShow similar products (0) >

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging15000
Sales UnitPiece

Features

AI Translation
  • Low-Voltage and Standard-Voltage Operation: – VCC = 1.7V to 5.5V
  • Internally Organized as 4,096 x 8 (32K)
  • Industrial Temperature Range: -40°C to +85°C
  • I²C-Compatible (2-Wire) Serial Interface:
    • 100 kHz Standard mode, 1.7V to 5.5V
    • 400 kHz Fast mode, 1.7V to 5.5V
    • 1 MHz Fast Mode Plus (FM+), 2.5V to 5.5V
    • Schmitt Triggers, Filtered Inputs for Noise Suppression
    • Bidirectional Data Transfer Protocol
  • Write-Protect Pin for Full Array Hardware Data Protection
  • Ultra Low Active Current (3 mA maximum) and Standby Current (6 μA maximum)
  • 32-Byte Page Write Mode:
    • Partial page writes allowed
  • Random and Sequential Read Modes
  • Self-Timed Write Cycle within 5 ms Maximum
  • High Reliability:
    • Endurance: 1,000,000 write cycles
    • Data retention: 100 years
  • Green Package Options (Lead-free/Halide-free/RoHS compliant)
  • Die Sale Options: Wafer Form and Bumped Wafers