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RENESAS IDT71P73804S250BQ product image
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RENESAS IDT71P73804S250BQ

Manufacturer
MPN
IDT71P73804S250BQ
LCSC Part #
C20581549
Packaging
165-CABGA (13x15)
Customer #
Key Attributes
18Mbit 1.7V~1.9V JTAG 165-CABGA (13x15) Memory (ICs)
Datasheetpdf iconRENESAS IDT71P73804S250BQ
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QtyUnit Price(Reference Only)Total Amount
1+$ 56.6343$ 56.63
136+$ 22.5988$ 3073.44
544+$ 21.8424$ 11882.27
952+$ 21.4703$ 20439.73
Standard Packaging136/Full Bag
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory (ICs)
ManufacturerRENESAS
Packaging165-CABGA (13x15)
Memory Size18Mbit
Voltage - Supply1.7V~1.9V
Operating temperature0℃~+70℃
FeaturesBuilt-in delay-locked loop;Boundary scan (JTAG) function
Current - Supply650mA
Standby Supply Current325mA
InterfaceJTAG

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging136
Sales UnitPiece

Introduction

AI Translation

The IDT DDRIITM Burst of four SRAMs are high-speed synchronous memories with a double-data-rate (DDR), bidirectional data port. This scheme allows maximization on the bandwidth on the data bus by passing two data items per clock cycle. The address bus operates at less than single data rate speeds, allowing the user to fan out addresses and ease system design while maintaining maximum performance on data transfers. The DDRII has scalable output impedance on its data output bus and echo clocks, allowing the user to tune the bus for low noise and high performance. All interfaces of the DDRII SRAM are HSTL, allowing speeds beyond SRAM devices that use any form of TTL interface. The interface can be scaled to higher voltages (up to 1.9V) to interface with 1.8V systems if necessary. The device has a VDDQ and a separate Vref, allowing the user to designate the interface operational voltage, independent of the device core voltage of 1.8V VDD. The output impedance control allows the user to adjust the drive strength to adapt to a wide range of loads and transmission lines.

Features

AI Translation
  • 18Mb Density (2Mx8, 2Mx9, 1Mx18, 512Kx36)
  • Common Read and Write Data Port
  • Dual Echo Clock Output
  • 4-Word Burst on all SRAM accesses
  • Multiplexed Address Bus One Read or One Write request per two clock cycles. DDR (Double Data Rate) Data Bus Four word bursts data per two clock cycles
  • Depth expansion through Control Logic
  • HSTL (1.5V) inputs that can be scaled to receive signals from 1.4V to 1.9V.
  • Scalable output drivers Can drive HSTL, 1.8V TTL or any voltage level from 1.4V to 1.9V. Output Impedance adjustable from 35 ohms to 70 ohms 1.8V Core Voltage (VDD)
  • JTAG Interface
  • 165-ball, 1.0mm pitch, 13mm x 15mm fBGA Package