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TI MSP430FR59941IPNRRoHS

Manufacturer
MPN
MSP430FR59941IPNR
LCSC Part #
C2055828
Packaging
LQFP-80(12x12)
Customer #
Key Attributes
MCU with 256KB FRAM, 8KB SRAM, LEA, AES, 12-bit ADC, comparator, DMA, 68 IOs, and eUSCI operating at 16MHz
Datasheetpdf iconTI MSP430FR59941IPNR
In-Stock: 43
43 In stock, ships now
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QtyUnit PriceTotal Amount
1+$ 8.3972$ 8.40
10+$ 8.2073$ 82.07
30+$ 8.0791$ 242.37
100+$ 7.9526$ 795.26
Standard Packaging1000/Full Reel
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/Microcontrollers
ManufacturerTI
PackagingLQFP-80(12x12)
ADC (Bit)12bit
Operating Temperature-40℃~+85℃
Voltage - Supply1.8V~3.6V
Program Memory TypeFRAM
EEPROM-
Program Storage Size256KB
CPU CoreMSP430 CPUXV2
Core Size16 Bit
CPU Maximum Speed16MHz
Oscillator TypeBuilt-in+External
Number of I/O68

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging1000
Sales UnitPiece

Introduction

AI Translation

The MSP430FR599x MCU raises the bar for low power and performance with a unique Low Energy Accelerator (LEA) for digital signal processing. The accelerator delivers 40x the performance of an Arm Cortex-M0+ MCU, helping developers efficiently process data using complex functions such as FFT, FIR, and matrix multiplication. A free DSP library enables implementation without requiring DSP expertise. In addition, these devices feature up to 256KB of unified FRAM memory, providing more space for advanced applications and greater flexibility for over-the-air firmware updates. The MSP ultra-low-power (ULP) FRAM MCU platform combines unique embedded FRAM with a comprehensive ultra-low-power system architecture, enabling system designers to increase performance at low energy consumption. FRAM technology combines the low-power fast write capability, flexibility, and endurance of RAM with the non-volatility of flash memory. The MSP430FR599x MCU is supported by an extensive hardware and software ecosystem, offering reference designs and code examples to help users get started quickly.

Applications

AI Translation
  • Grid infrastructure
  • Factory automation and control
  • Building automation
  • Portable medical and fitness equipment
  • Wearable electronics