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RENESAS R7FA6T3BB3CFM#AA0 product image
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RENESAS R7FA6T3BB3CFM#AA0RoHS

Manufacturer
MPN
R7FA6T3BB3CFM#AA0
LCSC Part #
C20353697
Packaging
LQFP-64(10x10)
Customer #
Key Attributes
CPU Performance and Peripheral Functions of RA6T3 Group
Datasheetpdf iconRENESAS R7FA6T3BB3CFM#AA0
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QtyUnit Price(Reference Only)Total Amount
1+$ 4.2573$ 4.26
10+$ 4.1605$ 41.61
30+$ 4.0955$ 122.87
100+$ 4.0305$ 403.05
Standard Packaging160/Full Tray
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/Microcontrollers
ManufacturerRENESAS
PackagingLQFP-64(10x10)
Operating Temperature-40℃~+105℃
Voltage - Supply2.7V~3.6V
Program Memory TypeFLASH
Program Storage Size256KB
CPU CoreARM Cortex-M33
Core Size32 Bit
CPU Maximum Speed240MHz

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging160
Sales UnitPiece

Introduction

AI Translation

The RA6T3 Group delivers up to 200 MHz of CPU performance using an Arm Cortex-M33 core with 256 KB of code flash memory, 4 KB of data flash memory, and 40 KB of SRAM. The RA6T3 Group offers a wide set of peripherals, including USB Full Speed, CANFD, I3C, and ADC.

Features

AI Translation
  • Arm Cortex-M33 Core
    • Armv8-M architecture with the main extension
    • Maximum operating frequency: 200 MHz
    • Arm Memory Protection Unit (Arm MPU) – Protected Memory System Architecture (PMSAv8) – Secure MPU (MPU_S): 8 regions – Non-secure MPU (MPU_NS): 8 regions
    • SysTick timer – Embeds two Systick timers: Secure and Non-secure instance – Driven by LOCO or system clock
    • CoreSight ETM-M33
  • Memory
    • Up to 256 KB code flash memory
    • 4 KB data flash memory (100,000 program/erase (P/E) cycles)
    • 40 KB SRAM
  • Connectivity
    • Serial Communications Interface (SCI)×2 – Asynchronous interfaces – 8-bit clock synchronous interface – Smart card interface – Simple IIC – Simple SPI – Manchester coding
    • I3C bus interface (I3C)
    • Serial Peripheral Interface (SPI)×2
    • USB 2.0 Full-Speed Module (USBFS)
    • CAN with Flexible Data-rate (CANFD)
  • Analog
    • 12-bit A/D Converter (ADC12) – Sample-and-hold circuits × 3 – Programmable Gain Amplifier × 3
    • High-Speed Analog Comparator (ACMPHS) × 3
    • 12-bit D/A Converter (DAC12) × 2
    • Temperature Sensor (TSN)
  • Timers
    • General PWM Timer 16-bit Enhanced (GPTl6E)×6
    • Low Power Asynchronous General Purpose Timer (AGT)×2
  • Security
    • Arm TrustZone – Up to three regions for the code flash – Up to two regions for the data flash – Up to three regions for the SRAM – Individual secure or non-secure security attribution for each peripheral
    • 128-bit unique ID
    • True Random Number Generator (TRNG)
    • Pin function – Secure pin multiplexing
  • System and Power Management
    • Low power modes
    • Event Link Controller (ELC)
    • Data Transfer Controller (DTC)
    • DMA Controller (DMAC)×8
    • Power-on reset
    • Low Voltage Detection (LVD) with voltage settings
    • Watchdog Timer (WDT)
    • Independent Watchdog Timer (IWDT)
  • Data Processing Accelerator
    • Trigonometric Function Unit (TFU)
  • Multiple Clock Sources
    • Main clock oscillator (MOSC) (8 to 24 MHz)
    • Sub-clock oscillator (SOSC) (32.768 kHz)
    • High-speed on-chip oscillator (HOCO) (16/18/20 MHz)
    • Middle-speed on-chip oscillator (MOCO) (8 MHz)
    • Low-speed on-chip oscillator (LOCO) (32.768 kHz)
    • IWDT-dedicated on-chip oscillator (15 kHz)
    • Clock trim function for HOCO/MOCO/LOCO
    • PLL
    • Clock out support
  • General-Purpose I/O Ports
    • 5-V tolerance, open drain, input pull-up, switchable driving ability
  • Operating Voltage
    • VCC: 2.7 to 3.6 V
  • Operating Temperature and Packages
    • Ta = -40℃ to +105℃
    • 64-pin LQFP (10 mm×10 mm, 0.5 mm pitch)
    • 48-pin LQFP (7 mm×7 mm, 0.5 mm pitch)
    • 48-pin QFN (7 mm×7 mm, 0.5 mm pitch)
    • 32-pin LQFP (7 mm×7 mm, 0.8 mm pitch)
    • 32-pin QFN (5 mm×5 mm, 0.5 mm pitch)