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Goertek GSBR-004A
| Manufacturer | GoertekAsian Brands |
| MPN | GSBR-004A |
| LCSC Part # | C20076600 |
| Packaging | - |
| Customer # | |
| Key Attributes | RF Misc ICs and Modules RoHS |
| Datasheet |  Goertek GSBR-004A |
Products Specifications
Show similar products (0) >| Type | Description | |
|---|---|---|
| Category | RF and Wireless/RF Misc ICs and Modules | |
| Manufacturer | Goertek | |
| Packaging | - | |
| Features | - |
Report an ErrorShow similar products (0) >
Additional Information
| Type | Details |
|---|---|
| Minimum | 1 |
| Multiple | 1 |
| Standard Packaging | 200 |
| Sales Unit | Piece |
| EDA Models | EasyEDA Model |
Introduction
AI Translation
GSBR-004A module is based on System in Package (SiP) technology which consists of a BES BES2600YP, Audio amplifier, LDO, Crystal and some other passive components. The SiP package technology combines several chipsets and many passive components. It significantly reduces the size of the product and provides more features in the same space for Truly Wireless Audio module.
Features
AI Translation
- Dual-mode BT5.3 with LE audio
- Support ANC
- Flash: 8MB
- External interconnection mode: interposer
- Weight: 0.36g
- Supply Voltage Range: 3.1V ~ 5.5V
- Operating Temp. Range: -40 ~ +85°C
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| Qty | Unit Price(Reference Only) | Total Amount |
|---|---|---|
| 1+ | $ 38.1737 | $ 38.17 |
| 200+ | $ 15.2328 | $ 3046.56 |
| 400+ | $ 14.724 | $ 5889.60 |
| 1,000+ | $ 14.4712 | $ 14471.20 |
Standard Packaging200/Full Reel | ||
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Products Specifications
Show similar products (0) >| Type | Description | |
|---|---|---|
| Category | RF and Wireless/RF Misc ICs and Modules | |
| Manufacturer | Goertek | |
| Packaging | - | |
| Features | - |
Report an ErrorShow similar products (0) >
Additional Information
| Type | Details |
|---|---|
| Minimum | 1 |
| Multiple | 1 |
| Standard Packaging | 200 |
| Sales Unit | Piece |
| EDA Models | EasyEDA Model |
Introduction
AI Translation
GSBR-004A module is based on System in Package (SiP) technology which consists of a BES BES2600YP, Audio amplifier, LDO, Crystal and some other passive components. The SiP package technology combines several chipsets and many passive components. It significantly reduces the size of the product and provides more features in the same space for Truly Wireless Audio module.
Features
AI Translation
- Dual-mode BT5.3 with LE audio
- Support ANC
- Flash: 8MB
- External interconnection mode: interposer
- Weight: 0.36g
- Supply Voltage Range: 3.1V ~ 5.5V
- Operating Temp. Range: -40 ~ +85°C
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | |
| ECCN | |
| CNHTS | |
| USHTS | |
| TARIC | |
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS |
| Type | Details |
|---|---|
| RoHS | |
| ECCN | |
| CNHTS | |
| USHTS | |
| TARIC |
| Type | Details |
|---|---|
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS | |