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KEMET T490B157M006ATE500RoHS

Manufacturer
MPN
T490B157M006ATE500
LCSC Part #
C19929409
Packaging
CASE-B-3528-21(mm)
Customer #
Key Attributes
Tantalum Capacitors
Datasheetpdf iconKEMET T490B157M006ATE500
In-Stock: 10
10 In stock, ships now
Add to BOM List
QtyUnit PriceTotal Amount
1+$ 0.6707$ 0.67
10+$ 0.6568$ 6.57
30+$ 0.6475$ 19.43
100+$ 0.6383$ 63.83
Standard Packaging2000/Full Reel
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Products Specifications

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TypeDescription
CategoryPassives/Capacitors/Tantalum Capacitors
ManufacturerKEMET
PackagingCASE-B-3528-21(mm)
Capacitance150uF
Voltage Rating6V
Current - Leakage9uA@25℃,5min
Equivalent Series Resistance(ESR)500mΩ@100kHz
Tolerance±20%

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging2000
Sales UnitPiece

Introduction

AI Translation

The KEMET T490 is specifically designed for customer product applications requiring low-temperature processing. Its leads are 100% matte tin-plated, the green molding compound is used, and it is RoHS compliant. The T490 achieves Moisture Sensitivity Level (MSL) 1 per J STD 020, meaning unlimited floor life at temperatures ≤30°C and 85% relative humidity. Sn/Pb terminations are available upon request for any part number. Gold-plated terminations are also available for conductive epoxy attachment processes. The standard packaging format for these devices is tape and reel per EIA 481, compatible with all tape-and-reel placement equipment.

Features

AI Translation
  • Standard EIA 481 tape-and-reel packaging
  • Symmetrical compatible terminations
  • Optional gold-plated terminations
  • Laser-marked case
  • Suitable for 3x 260°C reflow soldering
  • Halogen-free epoxy resin
  • Capacitance range: 47 - 470μF
  • Tolerance: ±20%
  • Rated voltage: 4 - 10 VDC
  • High reliability: 0.2% change per 1000 hours at 85°C, 0.5VR
  • Small and low-profile case size
  • RoHS compliant with lead-free terminations
  • MSL Level 1 at reflow temperature ≤260°C
  • Operating temperature range: -55°C ~ +125°C

Applications

AI Translation

Typical applications include decoupling and filtering in communication terminal applications such as mobile phones and consumer mobile devices.