LCSC Electronics logoLCSC Electronics svg logo
Sign In
USD
THALES EHS6-A REL.4 product image
Images for reference only

THALES EHS6-A REL.4RoHS

Manufacturer
MPN
EHS6-A REL.4
LCSC Part #
C1870669
Packaging
LGA-122
Customer #
Key Attributes
LGA-122 RF Transceiver ICs RoHS
Datasheetpdf iconTHALES EHS6-A REL.4
Out of Stock
Notify Me
Minimum: 1Multiple: 1Sales Unit: Piece
Add to BOM List
QtyUnit Price(Reference Only)Total Amount
1+$ 40.6844$ 40.68
200+$ 15.745$ 3149.00
500+$ 15.1909$ 7595.45
1,000+$ 14.9177$ 14917.70
Standard Packaging500/Full Reel
Better price for more quantity?
$

Products Specifications

All
TypeDescription
CategoryRF and Wireless/RF Transceiver ICs
ManufacturerTHALES
PackagingLGA-122
Features-

Introduction

AI Translation

The flagship Cinterion® EHS6 is the 5th generation of Thales’s Java embedded machine-to-machine (M2M) modules, which have simplified highly efficient, end-to-end industrial communication for the last decade. Thales’s Java strategy enables customers and partners to leverage the massive Java ecosystem by offering a powerful ARM11 architecture to reduce complexity and speed application integration. The tiny EHS6 module offers the latest Java ME 3.2 client runtime platform optimized for resource-constrained M2M applications. It significantly reduces total cost of ownership (TCO) and time to market by sharing internal resources such as memory, a large existing code base and proven software building blocks. The improved Java concept uses Multi MIDlet Java execution to simultaneously host and run multiple applications and protocols. An extended security concept with the latest TLS/SSL engine provides secure and reliable TCP/IP connectivity while an enriched internal flash file system enables free of charge firmware updates over-the-air (FOTA) when required. Sophisticated sandbox modeling and layered architectures simplify device management (DM) and separate mobile network operator approvals from application code development, allowing simultaneous progress of both phases for a shorter time to market. Providing the capability for multiple designs from one solution, the newest addition to Thales’s Industrial platform is an ideal module for M2M applications migrating from 2G to 3G that require cost efficiency along with global connectivity. EHS6 offers five band HSPA to support high bandwidth connectivity, enabling speeds up to 7.2 Mbps in downlink and 5.7 Mbps in uplink and rounds out the existing portfolio comprised of the Evolution platform. EHS6 comes in Thales’s unique Land Grid Array (LGA) package perfectly suited to the manufacturing needs of small, high-volume M2M devices with a focus on reliable and efficient processes. The ultra compact hardware design incorporates minimal power consumption, optimized heat dissipation even under harsh operating conditions and an extended product lifecycle to guarantee long product availability. EHS6 supports common industrial interfaces such as USB, serial interfaces, I²C and various GPIO’s to be connected with the Java engine.

Features

AI Translation
  • BIP secures broadband speed to eUICC (MIM / classic) to enable On-Demand Provision Service (OPS) and Remote Application Management by direct communication between eUICC and network based on internal TCP/IP stack. As a result it enables instant data connectivity on 1st use of a device, as well as a flexible mobile subscription throughout the lifecycle and a reduced number of customer device variants.
  • The EHS6 platform incorporates a variant supporting high quality digital and analog audio, which is often needed in alarm systems or e-call/ERA GLONASS solutions.
  • Java offers easy and fast application development, a broad choice of tools, high code reusability, easy maintenance, a proven security concept, on-device debugging as well as multithreading programming and program execution.
  • 3GPP Rel.7 Compliant Protocol Stack
  • Five Bands UMTS (WCDMA/FDD) Bands: 800, 850, 900, 1900 and 2100 MHz
  • Quad-Band GSM Bands: 850, 900, 1800 and 1900 MHz
  • SIM Application Toolkit, Class 3, with BIP and RunAT support
  • Embedded IP stack
  • Control via standardized and extended AT commands (Hayes, TS 27.007 and 27.005)
  • TCP/IP stack access via AT command and transparent TCP services
  • Secure Connection for client IP services
  • Internet Services TCP/UDP server/client, DNS, Ping, FTP client, HTTP client
  • Supply voltage range 3.1 - 4.5 V, highly optimized for minimal power consumption. (Baseband) Supply voltage range 2.8 - 4.5 V (RF-PA)
  • Dimension: 27.6×25.4×2.3 mm
  • Weight: 3 g
  • Operating Temperature: -40 °C to +90 °C
  • USB interface supports multiple composite modes and a Linux-/Mac- compliant mode
  • Firmware update via USB and serial interface
  • Real time clock with alarm functionality
  • Multiplexer according 3GPP TS 27.010
  • RLS Monitoring (Jamming detection) in 2G and 3G
  • Informal Network Scan
  • Customer IMEI/SIM-Lock as variant
  • Integrated FOTA, configurable and free of charge
  • Java™ ME 3.2
  • Secure data transmission with HTTPS/SSL
  • Multi-Threading programming and Multi-Application execution
  • 10 MB RAM and 10 MB Flash File System
  • Pad for GSM/WCDMA Antenna
  • USB 2.0 HS interface up to 480 Mbps
  • High speed serial modem interface ASC0
  • HSIC HS interface up to 480 Mbps
  • 16 GPIO lines shared with DSR, DTR, DCD (all ASC0), ASC1 (RXD, TXD, RTS, CTS), SPI, Fast-Shutdown, Network-Status-Indication
  • ADC and I2C interface
  • 4-wire high speed serial interfaces ASC1
  • Digital audio interface (analog audio opt