TE Connectivity 1-1002908-0

Piezoelectric films are available in a variety of sizes and thicknesses. Thinner films (28 and 52μm) are most common due to their higher capacitance and good mechanical properties. Thicker films (110μm) are used where maximum durability is required, or where sensors are used in thickness-mode (d33) applications. Metallization options include compliant silver ink and sputtered metallization. Silver ink is best suited for applications where mechanical stress is applied, as it facilitates the formation of custom metallization patterns for ease of lead attachment. Thin sputtered metallization is more brittle and is used where signal noise requirements demand very low electrode loading. The standard sputtered metallization is 700 Angstroms of copper over 100 Angstroms of nickel, transitioning the nickel-copper alloy to copper with nickel, offering good conductivity and oxidation resistance. Other metallizations such as gold are available on a custom basis but require setup fees. Sputtered metallization films have no borders. These are general guidelines only, and consulting with an application engineer will help make the best selection for a specific application.

Accelerometers, vibration/motion film sensors, audio/acoustic, switches, piezoelectric cables, traffic sensors, metallized piezoelectric film sheets for speakers, and more.