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Infineon TLE5014CPSEVALKITTOBO1RoHS

Manufacturer
MPN
TLE5014CPSEVALKITTOBO1
LCSC Part #
C17190930
Packaging
-
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Key Attributes
Sensor Evaluation Boards RoHS
Datasheetpdf iconInfineon TLE5014CPSEVALKITTOBO1
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1+$ 276.2906$ 276.29
200+$ 110.243$ 22048.60
500+$ 106.5589$ 53279.45
1,000+$ 104.7384$ 104738.40
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Introduction

AI Translation

This evaluation kit enables rapid and comprehensive evaluation of the TLE5014 GMR-based angle sensor. The kit consists of a programmer containing a microcontroller with a shield, and a satellite board. In addition to the hardware, a GUI is available for interacting with the sensor. The latest software version can be downloaded from the "Tools & Software" section of the Infineon TLE5014 webpage. A Micro-USB cable is required to connect the evaluation kit to a PC. Two different types of evaluation kits are available: the TLE5014CPS evaluation kit, featuring the TLE5014C16D/P16D/S16D (SENT/SPC/PWM interface); and the TLE5014SP evaluation kit, featuring the TLE5014SP16D (SSC interface). The programmer contains a microcontroller and a shield; the microcontroller board is the XMC™1100 Boot Kit, embedding an XMC™1100 with an on-board COM and Segger J-Link debugger, enabling communication between the microcontroller and PC via the Micro-USB port. The shield consists of an Infineon LDO (TLE4254), two SAE J2716-compliant SENT filters (which can be bypassed by adjusting the corresponding jumpers), and two connectors for different satellite boards. 2.54mm pin headers are also provided for easy signal probing with an oscilloscope or custom wiring. Two satellite boards are available: the TLE5014CPS satellite board and the TLE5014SP satellite board. The TLE5014CPS satellite board embeds the TLE5014F16D as a dual-chip sensor in an over/under configuration; users can modify internal settings, and the board includes discrete components such as decoupling capacitors. A 3D-printed rotating knob containing a magnet can be placed on the board for rapid prototyping and evaluation. The TLE5014SP satellite board embeds the TLE5014SP16D, which communicates with the microcontroller via the SSC interface, and likewise includes a 3D-printed rotating knob and magnet for rapid prototyping and evaluation.