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BOURNS 2026-09-A1FLF product image
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BOURNS 2026-09-A1FLFRoHS

Manufacturer
BOURNS
MPN
2026-09-A1FLF
LCSC Part #
C1566808
Packaging
-
Customer #
Key Attributes
GDT 90V 20kA 3 POLE
Datasheetpdf iconBOURNS 2026-09-A1FLF
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QtyUnit Price(Reference Only)Total Amount
1+$ 1.6932$ 1.69
200+$ 0.656$ 131.20
500+$ 0.6329$ 316.45
1,000+$ 0.6221$ 622.10
Standard Packaging100/Full Bag
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Products Specifications

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TypeDescription
CategoryCircuit Protection/Gas Discharge Tube Arresters (GDT)
ManufacturerBOURNS
Packaging-
Impulse Discharge Current20kA
Tolerance±20%
Voltage - DC Spark Over (Nom)90V
Capacitance2pF
Number of Poles3
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Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging100
Sales UnitPiece

Features

AI Translation
  • Test Methods per ITU-T K.12, IEEE C62.31 and IEC 61643-311 GDT standards.
  • In ionized mode.
  • Impulse Sparkover voltage is defined as typical values of distribution.
  • Impulse Transverse Delay...... ..1000 V/µs....... ....< 75 ns
  • Insulation Resistance..... .100 V (50 V for Model 2026–07 & 2026-09).. ....> 10^10 Ω
  • Glow Voltage..... .10 mA.. ..~ 70 V
  • Arc Voltage...... .1A.. ....~ 10 V
  • Glow-Arc Transition Current... ....< 0.5 A
  • Capacitance...... ..1 MHz.. ....< 2 pF
  • DC Holdover Voltage (3) . ...>135 V, (52 V for Model 2026-07 & 2026-09,... ....< 150 ms 80 V for Model 2026-15)
  • Impulse Discharge Current... .20000 A, 8/20 µs (4).. 10 operations 5000 A, 10/350 µs . 1 operation 1000 A, 10/1000 µs .. 400 operations
  • Alternating Discharge Current... ..130 Arms, 11 cycles (4).. 1 operation minimum 20 Arms, 1 s... 10 operations
  • Operation and Storage Temperature.. -40 to +90 °C
  • Climatic Category (IEC 60068-1)... 40/ 90/ 21
  • Moisture Sensitivity Level... 1
  • ESD Classification (HBM)... N/A
  • An optional Switch-Grade Fail-Short device is available. The optional Fail-Short assembly will activate at a temperature of 215 °C - 217 °C to provide a high conductive path to ground in case of a thermal overload. GDTs equipped with the optional Fail-Short device should be soldered either manually at a temperature that is below the activation temperature of the Fail-Short mechanism, or using a selective soldering process that does not exceed 210 °C.