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MICROCHIP ATWINC1500-MR210PB1952
| Manufacturer | |
| MPN | ATWINC1500-MR210PB1952 |
| LCSC Part # | C1526206 |
| Packaging | SMD,21.7x14.7mm |
| Customer # | |
| Key Attributes | IEEE 802.11 b/g/n SmartConnect IoT Module |
| Datasheet |  MICROCHIP ATWINC1500-MR210PB1952 |
Products Specifications
Show similar products (0) >| Type | Description | |
|---|---|---|
| Category | RF and Wireless/RF Transceiver Modules and Modems | |
| Manufacturer | MICROCHIP | |
| Packaging | SMD,21.7x14.7mm | |
| Frequency Range | 2.412GHz~2.472GHz;2.4GHz | |
| Voltage - Supply | 2.7V~3.6V | |
| Output Power | 18.5dBm | |
| Sensitivity | -95dBm | |
| Receive Current | 61mA | |
| Features | CRC check function;Supports FEC function | |
| Interface | SPI;UART;I2C | |
| Operating Temperature | -40℃~+85℃ | |
| Type | transceiver | |
| Current Of Transmitting | 268mA |
Report an ErrorShow similar products (0) >
Additional Information
| Type | Details |
|---|---|
| Minimum | 1 |
| Multiple | 1 |
| Standard Packaging | 50 |
| Sales Unit | Piece |
| EDA Models | EasyEDA Model |
Introduction
AI Translation
The ATWINC15x0-MR210xB is a low power consumption 802.11 b/g/n IoT (Internet of Things) module, specifically optimized for low power IoT applications. The module integrates Power Amplifier (PA), Low-Noise Amplifier (LNA), Switch, Power Management, and a printed antenna or a micro co-ax (u.FL) connector for an external antenna resulting in a small form factor (21.7×14.7×2.1 mm) design. It is interoperable with various vendors’ 802.11 b/g/n access points. This module provides SPI ports to interface with a host controller.
Features
AI Translation
- IEEE 802.11 b/g/n 20 MHz (1x1) solution
- Single spatial stream in 2.4 GHz ISM band
- Integrated Transmit/Receive switch
- Integrated PCB antenna or u.FL micro co-ax connector for external antenna
- Superior sensitivity and range via advanced PHY signal processing
- Advanced equalization and channel estimation
- Advanced carrier and timing synchronization
- Wi-Fi Direct (supported till firmware release 19.5.2)
- Soft-AP support
- Supports IEEE 802.11 WEP, WPA, WPA2 security
- Support Enterprise security with WPA/WPA2 (802.1X)
- EAP-TLS
- EAP-PEAPv0/1 with TLS
- EAP-TTLSv0 with MSCHAPv2
- EAP-PEAPv0/1 with MSCHAPv2
- Superior MAC throughput via hardware accelerated two-level A-MSDU/A-MPDU frame aggregation and block acknowledgment
- On-chip memory management engine to reduce host load
- SPI host interface
- Operating temperature range from -40°C to +85°C
- RF performance at room temperature of 25°C with a 2 - 3 db change at boundary conditions
- I/O operating voltage of 2.7V to 3.6V
- Built-in 26 MHz crystal
- Integrated Flash memory for system software
- Power Save modes
- 4 μA Power-Down mode typical at 3.3V I/O
- 380 μA Doze mode with chip settings preserved (used for beacon monitoring)
- On-chip low power sleep oscillator
- Fast host wake-up from Doze mode by a pin or SPI transaction
- Fast Boot options
- On-chip boot ROM (Firmware instant boot)
- SPI flash boot
- Low-leakage on-chip memory for state variables
- Fast AP re-association (150 ms)
- On-chip Network stack to offload MCU
- Integrated Network IP stack to minimize host CPU requirements
- Network features TCP, UDP, DHCP, ARP, HTTP, TLS, and DNS
- Hardware accelerators for Wi-Fi and TLS security to improve connection time
- Hardware accelerator for IP checksum
- Hardware accelerators for OTA security
- Small footprint host driver
- Wi-Fi Alliance certifications for Connectivity and Optimizations ID: WFA61069
In-Stock: 36
36 In stock, ships now
Add to BOM List
| Qty | Unit Price | Total Amount |
|---|---|---|
| 1+ | $ 15.5527 | $ 15.55 |
Standard Packaging50/Full Tray | ||
Better price for more quantity?
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Products Specifications
Show similar products (0) >| Type | Description | |
|---|---|---|
| Category | RF and Wireless/RF Transceiver Modules and Modems | |
| Manufacturer | MICROCHIP | |
| Packaging | SMD,21.7x14.7mm | |
| Frequency Range | 2.412GHz~2.472GHz;2.4GHz | |
| Voltage - Supply | 2.7V~3.6V | |
| Output Power | 18.5dBm | |
| Sensitivity | -95dBm | |
| Receive Current | 61mA | |
| Features | CRC check function;Supports FEC function | |
| Interface | SPI;UART;I2C | |
| Operating Temperature | -40℃~+85℃ | |
| Type | transceiver | |
| Current Of Transmitting | 268mA |
Report an ErrorShow similar products (0) >
Additional Information
| Type | Details |
|---|---|
| Minimum | 1 |
| Multiple | 1 |
| Standard Packaging | 50 |
| Sales Unit | Piece |
| EDA Models | EasyEDA Model |
Introduction
AI Translation
The ATWINC15x0-MR210xB is a low power consumption 802.11 b/g/n IoT (Internet of Things) module, specifically optimized for low power IoT applications. The module integrates Power Amplifier (PA), Low-Noise Amplifier (LNA), Switch, Power Management, and a printed antenna or a micro co-ax (u.FL) connector for an external antenna resulting in a small form factor (21.7×14.7×2.1 mm) design. It is interoperable with various vendors’ 802.11 b/g/n access points. This module provides SPI ports to interface with a host controller.
Features
AI Translation
- IEEE 802.11 b/g/n 20 MHz (1x1) solution
- Single spatial stream in 2.4 GHz ISM band
- Integrated Transmit/Receive switch
- Integrated PCB antenna or u.FL micro co-ax connector for external antenna
- Superior sensitivity and range via advanced PHY signal processing
- Advanced equalization and channel estimation
- Advanced carrier and timing synchronization
- Wi-Fi Direct (supported till firmware release 19.5.2)
- Soft-AP support
- Supports IEEE 802.11 WEP, WPA, WPA2 security
- Support Enterprise security with WPA/WPA2 (802.1X)
- EAP-TLS
- EAP-PEAPv0/1 with TLS
- EAP-TTLSv0 with MSCHAPv2
- EAP-PEAPv0/1 with MSCHAPv2
- Superior MAC throughput via hardware accelerated two-level A-MSDU/A-MPDU frame aggregation and block acknowledgment
- On-chip memory management engine to reduce host load
- SPI host interface
- Operating temperature range from -40°C to +85°C
- RF performance at room temperature of 25°C with a 2 - 3 db change at boundary conditions
- I/O operating voltage of 2.7V to 3.6V
- Built-in 26 MHz crystal
- Integrated Flash memory for system software
- Power Save modes
- 4 μA Power-Down mode typical at 3.3V I/O
- 380 μA Doze mode with chip settings preserved (used for beacon monitoring)
- On-chip low power sleep oscillator
- Fast host wake-up from Doze mode by a pin or SPI transaction
- Fast Boot options
- On-chip boot ROM (Firmware instant boot)
- SPI flash boot
- Low-leakage on-chip memory for state variables
- Fast AP re-association (150 ms)
- On-chip Network stack to offload MCU
- Integrated Network IP stack to minimize host CPU requirements
- Network features TCP, UDP, DHCP, ARP, HTTP, TLS, and DNS
- Hardware accelerators for Wi-Fi and TLS security to improve connection time
- Hardware accelerator for IP checksum
- Hardware accelerators for OTA security
- Small footprint host driver
- Wi-Fi Alliance certifications for Connectivity and Optimizations ID: WFA61069
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | |
| ECCN | 5A992C |
| CNHTS | 8542399000 |
| USHTS | 8542390001 |
| TARIC | 8542399000 |
| CAHTS | 8542390000 |
| BRHTS | 85423999 |
| INHTS | 85423900 |
| MXHTS | 8542.39.99 |
| Type | Details |
|---|---|
| RoHS | |
| ECCN | 5A992C |
| CNHTS | 8542399000 |
| USHTS | 8542390001 |
| TARIC | 8542399000 |
| Type | Details |
|---|---|
| CAHTS | 8542390000 |
| BRHTS | 85423999 |
| INHTS | 85423900 |
| MXHTS | 8542.39.99 |