TI AIC111RHB

The AIC111 is a DSP/μC compatible audio codec product, or analog interface circuit. It is part of a family of DSP/μC based high - performance analog interface solutions. It is targeted at personal medical devices, aural preprocessing applications, and low - power headset applications. It is used in designs requiring a programmable time constant PGA/compressor interface, high dynamic range analog - to - digital converter, an external DSP/μC handling signal processing, or a low distortion digital - to - analog converter with a balanced H - Bridge speaker driver. It supports a CMOS digital interface tailored for TI DSPs with the McBSP protocol and SPI - based controllers. It also has an external microphone or sensor supply and bias and power supply up low - battery monitor indicator.

• Single Channel Codec Noise Shaped Delta Sigma ADC and DAC Technology
• Low Supply Voltage and Current: 1.3 - V Typical Power Supply, 350 - μA Typical Supply Current Drain
• Power Supply Up Monitor and Low Battery Monitor That Also Automatically Shuts Off HBridge Output When Battery Decays Below 1.05 V in a Nontransient Manner
• Typical 4 - μVrms Input Referred Noise With 0.01% Total Harmonic Distortion for Front End and 108 - dB Dynamic Range; ADC Has 87 - dB Dynamic Range With 73 - dB Total Harmonic Distortion 100 Hz - 10 kHz, 40 - kHz Sampling Rate
• Typical 55 - dB PSRR 100 Hz to 10 kHz for Analog Front End
• Low Noise Programmable Gain Amplifier/Compressor Front End With Programmable Fast and Slow Attack and Decay Rates With Dual or Single Attack and Decay Rate Option
• Typical Output Noise of 12 μVrms With 0.05% Total Harmonic Distortion for Delta Sigma DAC and H - Bridge Output Driver
• Low Jitter Oscillator That Generates all Internal Clocks and Generates 5 - MHz Output DSP/μC Clock
• Regulated Bandgap Voltage Reference
• Programmable Functionality via Digital Serial Interface: McBSP Interface, DSP Protocol (TI TMS320VC54x, TMS320VC55x DSPs); SPI Interface, Microcontroller Protocol (TI MSP430xx)
• External Chip Power Down and Reset
• Available in: 32 - Pin QFN 5×5 - mm Plastic Package; 32 - Pad Bumped Die in Waffle Pack (wafer scale packaging)

• Hearing Instruments
• Personal Medical Devices
• Hearing Protection
• Aural Processing Low - Power Headsets