Infineon/CYPRESS CYUSB3314-88LTXC

HX3 is a family of USB 3.0 hub controllers compliant with the USB 3.0 specification revision 1.0. HX3 supports SuperSpeed (SS), Hi-Speed (HS), Full-Speed (FS), and Low-Speed (LS) on all the ports. It has integrated termination, pull-up, and pull-down resistors, and supports configuration options through pin-straps to reduce the overall BOM of the system.

HX3 includes the following Cypress-proprietary features:

Shared Link™: Enables extra downstream (DS) ports for on-board connections in embedded applications Ghost Charge™: Enables charging of devices connected to the DS ports when no host is connected on the upstream (US) port

• USB-IF Certified Hub, TID# 330000060, 30000074
• Supports up to Four USB 3.0-Compliant DS ports
  • All ports support SS (5 Gbps), and are backward-compatible with HS (480 Mbps), FS (12 Mbps), and LS (1.5 Mbps) and USB 2.0 Link Power Management (LPM)
  • Dedicated Hi-Speed Transaction Translators (Multi-TT)
  • LED status indicators – suspend, SS, and USB 2.0 operation
• Shared Link™ for Embedded Applications
  • Each DS port can simultaneously connect to an embedded SS device and a removable USB 2.0 device
  • Enables up to eight device connections
• Enhanced Battery Charging
  • Each DS port complies with the USB Battery Charging v1.2 (BC v1.2) specification
  • Ghost Charge™: Each DS port can emulate a Dedicated Charging Port (DCP) when the host is not connected to the US port
  • Accessory Charger Adapter Dock (ACA-Dock): Enables charging and simultaneous data transfer for a smart phone or a tablet acting as a host compliant to BC v1.2
  • Apple charging supported on all DS ports
• Integrated ARM Cortex-M0 CPU
  • 16 KB RAM, 32 KB ROM
  • Configure GPIOs for overcurrent protection, power enable, and LEDs
  • Upgrade firmware using (a) I²C EEPROM or (b) an external I²C master
• Vendor-Command Support to Implement a USB-to-I²C Bridge
  • Firmware upgrade of an external ASSP connected to HX3 through USB
  • In-System Programming (ISP) of the EEPROM connected to HX3 through USB
• Extensive Configuration Support
  • Vendor ID (VID)
  • Charging support for each DS port
  • Number of active ports
  • Number of non-removable devices
  • Ganged or individual power switch enables for DS ports
  • Power switch polarity selection
  • Custom configuration modes supported with eFuse, I2C EEPROM, or I²C slave
  • SS and USB 2.0 PHY parameters
  • Product ID (PID)/VID, manufacturer, and product string descriptors
  • Swap DP/DM signals for flexible PCB routing
  • Microsoft WHQL-certified for Windows XP/Vista/7/8/8.1
  • Compatible with Mac OS 10.9 and Linux kernel version 3.11
  • Customize configuration parameters with the easy-to-use Cypress’s “Blaster Plus” software tool
• Flexible Packaging Options
  • 68-pin QFN (8x8x1.0 mm)
  • 88-pin QFN (10x10x1.0 mm)
  • 100-ball BGA (6x6x1.0 mm)
  • Industrial temperature range -40 ℃ to +85 ℃