VISHAY SIRA00DP-T1-GE3
| Manufacturer | |
| MPN | SIRA00DP-T1-GE3 |
| LCSC Part # | C141540 |
| Packaging | PowerPAK-SO-8 |
| Customer # | |
| Key Attributes | MOSFET N-CH 30V 100A PowerPAK-SO-8 |
| Datasheet |
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs | |
| Manufacturer | VISHAY | |
| Packaging | PowerPAK-SO-8 | |
| Drain to Source Voltage | 30V | |
| Output Capacitance(Coss) | 3.32nF | |
| Current - Continuous Drain(Id) | 100A | |
| Operating Temperature - | -55℃~+150℃ | |
| Gate Threshold Voltage (Vgs(th)) | 2.2V | |
| Pd - Power Dissipation | 104W | |
| Reverse Transfer Capacitance (Crss@Vds) | 360pF | |
| RDS(on) | 1.35mΩ@4.5V | |
| Number | 1 N-channel | |
| Input Capacitance(Ciss) | 11.7nF | |
| Gate Charge(Qg) | 220nC@10V | |
| Type | N-Channel |
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs | |
| Manufacturer | VISHAY | |
| Packaging | PowerPAK-SO-8 | |
| Drain to Source Voltage | 30V | |
| Output Capacitance(Coss) | 3.32nF | |
| Current - Continuous Drain(Id) | 100A | |
| Operating Temperature - | -55℃~+150℃ | |
| Gate Threshold Voltage (Vgs(th)) | 2.2V |
| Type | Description | |
|---|---|---|
| Pd - Power Dissipation | 104W | |
| Reverse Transfer Capacitance (Crss@Vds) | 360pF | |
| RDS(on) | 1.35mΩ@4.5V | |
| Number | 1 N-channel | |
| Input Capacitance(Ciss) | 11.7nF | |
| Gate Charge(Qg) | 220nC@10V | |
| Type | N-Channel |
Introduction
N-Channel 30 V (D-S) MOSFET. PowerPAK is a new package technology developed around the SO-8 footprint. The PowerPAK SO-8 shares the same footprint and pin-out as the standard SO-8, offering a direct drop-in replacement. As a leadless package, it utilizes the entire SO-8 footprint to accommodate a larger die than the standard SO-8. The exposed thermal pad on the bottom of the die provides a direct, low-resistance thermal path to the mounting substrate, and the package height is lower than that of the standard SO-8, making it suitable for space-constrained applications.
Features
- TrenchFET Gen IV Power MOSFET
- 100% Rg and UIS Tested
Applications
- Synchronous Rectification
- ORing
- High Power Density DC/DC VRMs and Embedded DC/DC
| Qty | Unit Price | Total Amount |
|---|---|---|
| 1+ | $ 1.3305 | $ 1.33 |
| 10+ | $ 1.2252 | $ 12.25 |
| 30+ | $ 1.1587 | $ 34.76 |
| 100+ | $ 1.0923 | $ 109.23 |
| 500+ | $ 0.9513 | $ 475.65 |
| 1,000+ | $ 0.9383 | $ 938.30 |
Standard Packaging3000/Full Reel | ||
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs | |
| Manufacturer | VISHAY | |
| Packaging | PowerPAK-SO-8 | |
| Drain to Source Voltage | 30V | |
| Output Capacitance(Coss) | 3.32nF | |
| Current - Continuous Drain(Id) | 100A | |
| Operating Temperature - | -55℃~+150℃ | |
| Gate Threshold Voltage (Vgs(th)) | 2.2V | |
| Pd - Power Dissipation | 104W | |
| Reverse Transfer Capacitance (Crss@Vds) | 360pF | |
| RDS(on) | 1.35mΩ@4.5V | |
| Number | 1 N-channel | |
| Input Capacitance(Ciss) | 11.7nF | |
| Gate Charge(Qg) | 220nC@10V | |
| Type | N-Channel |
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs | |
| Manufacturer | VISHAY | |
| Packaging | PowerPAK-SO-8 | |
| Drain to Source Voltage | 30V | |
| Output Capacitance(Coss) | 3.32nF | |
| Current - Continuous Drain(Id) | 100A | |
| Operating Temperature - | -55℃~+150℃ | |
| Gate Threshold Voltage (Vgs(th)) | 2.2V |
| Type | Description | |
|---|---|---|
| Pd - Power Dissipation | 104W | |
| Reverse Transfer Capacitance (Crss@Vds) | 360pF | |
| RDS(on) | 1.35mΩ@4.5V | |
| Number | 1 N-channel | |
| Input Capacitance(Ciss) | 11.7nF | |
| Gate Charge(Qg) | 220nC@10V | |
| Type | N-Channel |
Introduction
N-Channel 30 V (D-S) MOSFET. PowerPAK is a new package technology developed around the SO-8 footprint. The PowerPAK SO-8 shares the same footprint and pin-out as the standard SO-8, offering a direct drop-in replacement. As a leadless package, it utilizes the entire SO-8 footprint to accommodate a larger die than the standard SO-8. The exposed thermal pad on the bottom of the die provides a direct, low-resistance thermal path to the mounting substrate, and the package height is lower than that of the standard SO-8, making it suitable for space-constrained applications.
Features
- TrenchFET Gen IV Power MOSFET
- 100% Rg and UIS Tested
Applications
- Synchronous Rectification
- ORing
- High Power Density DC/DC VRMs and Embedded DC/DC
C141540 EasyEDA Library
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | |
| ECCN | EAR99 |
| CNHTS | 8541290000 |
| USHTS | 8541290095 |
| TARIC | 8541290000 |
| CAHTS | 8541290000 |
| BRHTS | 85412910 |
| INHTS | 85412900 |
| MXHTS | 8541.29.99 |
| Type | Details |
|---|---|
| RoHS | |
| ECCN | EAR99 |
| CNHTS | 8541290000 |
| USHTS | 8541290095 |
| TARIC | 8541290000 |
| Type | Details |
|---|---|
| CAHTS | 8541290000 |
| BRHTS | 85412910 |
| INHTS | 85412900 |
| MXHTS | 8541.29.99 |



