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TI CSD97374Q4MRoHS

Manufacturer
MPN
CSD97374Q4M
LCSC Part #
C140327
Packaging
VSON-CLIP-8(3.5x4.5)
Customer #
Key Attributes
Synchronous Buck NexFET Power Stage
Datasheetpdf iconTI CSD97374Q4M
In-Stock: 803
803 In stock, ships now
Add to BOM List
QtyUnit PriceTotal Amount
1+$ 2.5685$ 2.57
10+$ 2.1988$ 21.99
30+$ 1.9669$ 59.01
100+$ 1.5681$ 156.81
500+$ 1.461$ 730.50
1,000+$ 1.414$ 1414.00
Standard Packaging2500/Full Reel
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Power Management (PMIC)/Full Half-Bridge (H Bridge) Drivers
ManufacturerTI
PackagingVSON-CLIP-8(3.5x4.5)
Driven ConfigurationHigh Side;Low Side
Load TypeMOSFET
Current - Output High(IOH)-
Input Logic Level - High2.65V
Rise Time-
Fall Time-
Propagation Delay tpLH-;-
Current - Output Low(IOL)-
Operating Temperature-40℃~+125℃
FeaturesUnder Voltage Protection;Built-in bootstrap diode
Quiescent Current130uA
Voltage - Supply4.5V~5.5V
Input Logic Level - Low600mV

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging2500
Sales UnitPiece

Introduction

AI Translation

The CSD97374Q4M NexFET power stage is a highly optimized design for use in a high-power, highdensity synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows 8. With the PWM input in tri-state, quiescent current is reduced to 130 μA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 μA (typically 20 μs is required to resume switching). This combination produces a high-current, high-efficiency, and highspeed switching device in a small 3.5–mm × 4.5–mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

Features

AI Translation
  • Over 92% System Efficiency at 15 A
  • Max Rated Continuous Current 25 A, Peak 60 A
  • High-Frequency Operation (up to 2 MHz)
  • High-Density SON 3.5-mm x 4.5-mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3-V and 5-V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

Applications

AI Translation
  • Ultrabook/Notebook DC/DC Converters
  • Multiphase Vcore and DDR Solutions
  • Point-of-Load Synchronous Buck in Networking, Telecom, and Computing Systems