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ST SM6T24ARoHS

Manufacturer
MPN
SM6T24A
LCSC Part #
C133694
Packaging
SMB(DO-214AA)
Customer #
Key Attributes
TVS DIODE 24VWM 42.8VC SMB(DO-214AA)
Datasheetpdf iconST SM6T24A
In-Stock: 80
80 In stock, ships now
Add to BOM List
QtyUnit PriceTotal Amount
5+$ 0.1832$ 0.92
50+$ 0.1427$ 7.14
150+$ 0.1254$ 18.81
500+$ 0.1038$ 51.90
2,500+$ 0.0941$ 235.25
5,000+$ 0.0884$ 442.00
Standard Packaging2500/Full Reel
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Products Specifications

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TypeDescription
CategoryCircuit Protection/Transient Voltage Suppressors (TVS)/TVS Diodes
ManufacturerST
PackagingSMB(DO-214AA)
Clamping Voltage42.8V
Operating Temperature-55℃~+150℃
Peak Pulse Current (Ipp)93A@8/20us
Peak Pulse Power Dissipation (Ppp)600W
Voltage - Breakdown24V
typeTVS
Reverse Leakage Current (Ir)200nA
PolarityUnidirectional
Reverse Stand-Off Voltage (Vrwm)24V

Additional Information

TypeDetails
Minimum5
Multiple5
Standard Packaging2500
Sales UnitPiece

Introduction

AI Translation

The SM6T Transil series has been designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2 and MIL STD 883, method 3015, and electrical overstress according to IEC 61000-4-4 and 5. These devices are more generally used against surges below 600 W (10/1000 µs). Planar technology makes these devices suitable for high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. SM6T are packaged in SMB (SMB footprint in accordance with IPC 7531 standard).

Features

AI Translation
  • Peak pulse power: – 600 W (10/1000 µs) – 4 kW (8/20 µs)
  • Breakdown voltage range: from 6.8 V to 220 V
  • Unidirectional and bidirectional types
  • Low leakage current: – 0.2 µA at 25 °C – 1 µA at 85 °C
  • Operating Tj max: 150 °C
  • High power capability at Tjmax: – 515 W (10/1000 µs) JEDEC registered package outline
  • IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge)
  • IEC 61000-4-5
  • MIL STD 883G, method 3015-7: class 3B: – 25 kV HBM (human body model)
  • UL 497B, file number: QVGQ2.E136224
  • Resin meets UL 94, V0
  • MIL-STD-750, method 2026 soldererability
  • EIA STD RS-481 and IEC 60286-3 packing
  • IPC 7531 footprint