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TI SN74ABT541BPWRRoHS

Manufacturer
MPN
SN74ABT541BPWR
LCSC Part #
C131956
Packaging
TSSOP-20
Customer #
Key Attributes
OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
Datasheetpdf iconTI SN74ABT541BPWR
In-Stock: 227
227 In stock, ships now
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QtyUnit PriceTotal Amount
1+$ 1.1521$ 1.15
10+$ 0.9574$ 9.57
30+$ 0.8503$ 25.51
100+$ 0.7286$ 72.86
500+$ 0.6248$ 312.40
1,000+$ 0.602$ 602.00
Standard Packaging2000/Full Reel
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Logic/Buffers, Drivers, Receivers, Transceivers
ManufacturerTI
PackagingTSSOP-20
Input type-
Voltage - Supply4.5V~5.5V
Output TypeTri-State
Current - Output High(IOH)32mA
Series74ABT
Operating Temperature-40℃~+85℃
Current - Output Low(IOL)64mA
Number of Bits per Element8
Channel TypeUnidirectional
FeaturesPower-off isolation;Output enable
Number of Elements1
Quiescent Current250uA
Propagation Delay2ns@5V,50pF

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging2000
Sales UnitPiece

Introduction

AI Translation

The SN54ABT541 and SN74ABT541B octal buffers and line drivers are ideal for driving bus lines or buffering memory address registers. The devices feature inputs and outputs on opposite sides of the package to facilitate printed circuit board layout. The 3-state control gate is a two-input AND gate with active-low inputs so that if either output-enable (OE1 or OE2) input is high, all eight outputs are in the high-impedance state. When VCC is between 0 and 2.1V the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Features

AI Translation
  • State-of-the-Art EPiC-IIB BiCMOS Design Significantly Reduces Power Dissipation
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 1V at VCC = 5V, TA = 25℃
  • High-Impedance State During Power Up and Power Down
  • High-Drive Outputs (-32 mA IOH, 64 mA IOL)
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Package, and Plastic (N) and Ceramic (J) DIPs