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TI TPS22925BYPHRRoHS

Fabricant
TI
Réf. Fab.
TPS22925BYPHR
Réf. LCSC
C2149829
Condit.
DSBGA-6
Numéro Client
Caract. clés
Load switch with 3.6V, 3A, and on-resistance of 9mΩ
Fiche Techniquepdf iconTI TPS22925BYPHR
En stock: 89
89 En stock, expédition immédiate
Minimum: 1Multiple: 1Unité de vente: Piece
Ajouter à la Liste BOM
QtéPrix unit.Montant total
1+$ 0.5327$ 0.53
10+$ 0.5213$ 5.21
30+$ 0.5132$ 15.40
100+$ 0.505$ 50.50
Boîtier Standard3000/Full Reel
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Spécifications du Produit

Tout
TypeDescription
CatégorieIntegrated Circuits (ICs)/Power Management (PMIC)/Power Distribution Switches, Load Drivers
FabricantTI
Condit.DSBGA-6
Operating Temperature-40℃~+105℃
FeaturesReverse current blocking;Output discharge function;Soft-start
number of channels1
Control Input LogicActive High
Maximum Continuous Current3A
RDS(on)9.2mΩ
Operating Voltage650mV~3.6V
TypeLoad Switch
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Description

Traduction par IA

The TPS22925 product family includes four devices: TPS22925B, TPS22925BN, TPS22925C, and TPS22925CN. Each device is a slew-rate-controlled 9mΩ single-channel load switch. The family incorporates an N-channel MOSFET that operates over an input voltage range of 0.65V to 3.6V, supporting up to 3A continuous current. This continuous current capability makes the family suitable for a wide range of designs and end equipment. Each device in the TPS22925 family provides reverse current blocking when disabled, protecting the power supply and enabling power multiplexing. The controllable rise time significantly reduces inrush current caused by large load capacitances, thereby reducing or eliminating power supply voltage droop. At an operating input voltage of 3.6V, the TPS22925Bx devices have a rise time of 97μs, while the TPS22925Cx devices have a rise time of 810μs. The TPS22925 family offers an optional integrated 150Ω pull-down resistor for fast quick output discharge (QOD) when the switch is open, helping to reduce overall solution size. Each device in the TPS22925 family is available in a 6-pin 0.9mm×1.4mm, 0.5mm pitch, 0.4mm height wafer-level chip-scale package (WCSP), enabling smaller and more highly integrated designs. The WCSP package combined with the 9mΩ on-resistance makes the family well suited for space-constrained, battery-powered applications. Devices are rated for an operating temperature range of -40°C to 105°C in still air.

Caractéristiques

Traduction par IA
  • Input voltage range: 0.65V to 3.6V
  • On-resistance: RON = 9.2mΩ at VIN = 3.6V; RON = 9.2mΩ at VIN = 1.8V; RON = 10.2mΩ at VIN = 1V; RON = 13.1mΩ at VIN = 0.65V
  • 3A maximum continuous switching current, quiescent current IQ,VIN = 29μA (at VIN = 3.6V)
  • Low control input threshold, compatible with 1.2V, 1.8V, 2.5V, or 3.3V logic devices
  • Controlled slew rate: tR = 97μs (at VIN = 3.6V) (TPS22925Bx); tR = 810μs (at VIN = 3.6V) (TPS22925Cx)
  • Reverse current blocking (when disabled)
  • Quick output discharge (QOD) (TPS22925B and TPS22925C only)
  • Wafer-level chip-scale package

Applications

Traduction par IA
  • Computing
  • Solid State Drive (SSD)
  • Tablet
  • Wearables
  • Electronic Point of Sale (EPOS)