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KIOXIA THGBMJG7C1LBAILRoHS

Manufacturer
KIOXIA
MPN
THGBMJG7C1LBAIL
LCSC Part #
C879825
Packaging
FBGA-153
Customer #
Key Attributes
e-MMC Module
Datasheetpdf iconKIOXIA THGBMJG7C1LBAIL
In-Stock: 2
2 In stock, ships now
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Once stock is depleted, this item will be marked as "Out of Stock."
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Minimum: 1Multiple: 1Sales Unit: Piece
QtyUnit PriceTotal Amount
1+$ 48.8361$ 48.84
10+$ 47.2578$ 472.58
Standard Packaging152/Full Tray

Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory
ManufacturerKIOXIA
PackagingFBGA-153
Operating Temperature-25℃~+85℃
FeaturesBad block management function;Hardware reset function
Memory Size16GB
Reading Speed in Sequence220MB/S
Writing Speed in Sequence45MB/S
NAND Flash Type-
NAND Stand-By Current-
Controller Stand-By Current-
NAND Operating Voltage (VCCF)2.7V~3.6V
InterfaceeMMC 5.1
Controller Operating Voltage (VCCQ)1.7V~1.95V;2.7V~3.6V
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Introduction

AI Translation

THGBMJG7C1LBAIL is 16GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMJG7C1LBAIL has an industry standard MMC protocol for easy use.